Engineer Manager

SOMANAHALLI UMESH * abipwo@r.postjobfree.com

SOMANAHALLI UMESH

**** ****** **** 512-***-**** Home

Round Rock, Tx 78665 512-***-**** Cell

SUMMARY

Electrical and computer engineer with extensive experience in program management, project

management and product engineering, managing all phases from new product development to final

manufacturing. Excellent overall knowledge of IC design, fabrication, assembly, packaging, testing

and product qualification. Demonstrated broad understanding of both technical and business aspects

of the operation. Focused on problem solving and creating solutions with a proven track record of

successfully leading and collaborating with global engineering cross functional teams. Experienced

in taking ASIC’s, CPU’s from First silicon to production. Experienced in defining and managing

key product deliverables and schedules across cross functional teams. Adept in managing projects

horizontally across multiple internal functional organizations (engineering,supply management,finance ). Adept in root cause analysis in complex situations and implementing cost-effective

corrective actions within the company or through collaboration. Well versed with internal and

customer IC reliability qualification requirements. Fluent in multiple languages with strong inter

personal skills working hands on with multiple offshore Asian engineering teams.

CORE COMPETENCIES

• • •

Program Management IP acquisition Reliability

• •

Project Management Technology Transfer qualification

• • •

Product Engineering Foundry Transfers IC Supply chain

• • •

Product Development Global Collaboration

• •

PMP in progress Change Management

PROFESSIONAL EXPERIENCE

FREESCALE SEMICONDUCTORS Inc., Austin, TX

IP Development Program Manager PMO, IPD, NMG 3/06 – 5/30/09

Program Manager for IP development group of engineers developing new digital and Analog IP

blocks worldwide for multi core networking products.

• Developed and managed statement of work between the global IP development team and

SOC design teams for deliverables in 45soi process technology resulting in 20% cycle time

improvement in IP deployment.

• Achieved 95% on time delivery of 30 analog soft IP and 15 digital hard IP to four 45soi

technology multi core new products in development simultaneously.

• Drove Primavera enterprise tool and time sheet process in IP development to manage

schedules by converting design engineers to enter project progress weekly resulting in block

owners taking ownership of the project progress.

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• Created weekly committed vs forecast, 4-week window, critical path analysis reports which

helped functional managers to resolve real time resource and schedule issues.

• Developed and trained IPD to utilize IP template and integrated checklists into primavera

resulting in 25% improved cycle time in new schedule development process.

NPI Program Manager, PMO, MCD, TSPG 1/05 – 3/06

Core Team Leader responsible for managing new projects through the Freescale New product

development methodology of concept, definition, planning, execution, and validation to cost

effective production ramp up.

Built the core team and managed 8 strategic new products through all phases of new product

development cycle to manufacturing in support of business and revenue objectives of the

division.

Responsible for releasing 6 ASIC projects ifrom first silicon to mass production with a total

lifetime revenue forecasted to exceed 600 million dollars.

Managed several critical IP acquisitions from outside vendors as part of a strategy to

minimize schedule and resource impact with overall savings to total development cost.

Established strong program management relationship with India design resources for

execution of SOC projects led by US product management team

MOTOROLA Inc. 32bit Embedded controller division, SPS, Austin, TX 1997 – 2005

Product Engineering Manager responsible for the digital hard copy imaging

operation printer controller strategic products. Led both product engineering

and program management resources in development and manufacturing of SOC

's while driving the pursuit of new business quote response .

Managed cost reduction efforts on division’s selected high volume product resulting in 86%

margin in 2001 through die shrink foundry transfer and test reduction.

Recognized for leading a cross functional team of product development and product engineering

involved in development of low cost version of the Power PC 603ei to successful production

release with a life revenue exceeding 300 million dollars.

Drove implementation of several defect density reduction programs in foundry and test program

enhancements resulting in 20% probe yield improvement.

Responsible for driving the engineering quote response process with marketing to win several

custom ASIC designs in Hard copy imaging market.

Managed design fix to the cold sensitivity problem on a Iomega 2nd sourced storage product

resulting in revenue upside of 6M$ per quarter during 1999.

• Rated at top 20% with CE (Consistently Exceeded performance expectations) rating each year

for 5 years.

ADVANCED MICRO DEVICES Inc., Austin TX 1987-1997

Product Engineering Supervisor, Logic Products Division

Supervised an engineering and technician team in a wide array of engineering activities associated

with the manufacturing support of the AM29000 RISC processor family at both domestic and

offshore. Also responsible for qualification of new products.

Managed major cost reduction projects. Implemented single insertion flow. Reduced burn-in

duration. Simplified flow. Upgraded test programs for better node overage. Final cost reduced

about 100% in 2 years. Aprox. $3M /yr in cost savings, which helped to maintain division

margin above the target.

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Working with HR started COOP program. Managed, mentored and developed new COOP’s.

Managed internal and customer qualifications which included many die revs, process

improvements, assembly and package changes. Qualified 29k in TSMC foundry.

Pushed the limit of failure acceleration by engineering a high performance drivers

Capable of variable Freq., VCC and functional patterns through EPROM.

Saved aprox. $300k by purchasing used burn-in ovens and installing in offshore.

Developed software database for 29k product qualification and FIT rate calculations.

Device Engineer Fab15

Supported fab and product lines with yield and failure analysis on all the CMOS logic products

such that majority of the products met or exceeded the year-end yield goals. Supported process /

product characterization, test floor operations, new product transfers.

Implemented process change monitor to track and feed back process change impact on Product

performance and reliability.

Optimized and custom fit the Murphy Seed model to forecast defect density / yield for all

CMOS process for new and existing products in the fab.

TEXAS INSTRUMENTS Inc., Dallas, TX 1983-

1987

Front End Product Engineer: DMOS IV, Dallas, TX

Responsible for development of pre-laser and probe test programs for 256k DRAM. Involved in

identification and fixing of the yield barriers over the process and design parameters, defining

process control limits, yield and cost tracking and failure analysis of low yield lots.

Successfully implemented hardware and software for testing 256k DRAM.

Improved throughput 30% by implementing 2-wide and 4-wide parallel testing.

Back -End Test and product Engineer: PPD Houston, TX.

Product Engineer responsible for the 4-bit and 8-bit microcomputers used in the calculators. Responsible for

production, process and product characterization and technical support for customers.

On temporary assignment worked in fab to develop 1u CMOS process for the 8bit microcomputer

products. Generated CMOS Megatest test programs and implemented it at various sites.

Implemented Xtl-Osc, Keypush and display tests to reduce burn-in fallout.

EDUCATION

M.S. in Electrical and Computer Engineering Syracuse University, Syracuse NY

BS in Electrical Engineering National Institute of Eng, India

DPM Diploma in Computer Management SIES Institute, Bombay, India

AWARDS and PUBLICATIONS

AMD vice-president Spot Light Award for exceptional achievement

AMD Mentor of the semester award by summer COOP program

Paper on comprehensive packaging analysis of Am29000 in Temp cycle

AM29000 Reliability qualification customer report,

Member of Reliability qualification advisory council

Plaques- In recognition of design and tapeout of Low cost PPC 603ei with G2H4 core,

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Plaque – In recognition of P4080 45soi technology multi core project design support.

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