Sravan Gondipalli

**** ********** ***** ******** *******, MO 63043 607-***-****

abi1ei@r.postjobfree.com

SUMMARY

. Three years of experience in numerical modeling and analyzing

challenging thermal and fluid problems using 3D CAD and CFD models

resulting in four publications.

. M.S. Industrial Engineering with emphasis on Electronics Packaging,

Thermal management and CFD.

. Hands-on experience in numerical 3D CFD modeling using Fluent, Icepak

and FloTHERM .

. Certificate of Electronics Packaging by IEEC at the Binghamton

University.

. Proficient in FEA and CAD solid modeling tools of SolidWorks, Pro-E and

Auto-CAD.

. Extensive knowledge in electronics cooling, Numerical Modeling, CFD,

Heat Transfer, Fluid mechanics, Mechanical Design, GD&T, structural

analysis, DOE, Lean Six Sigma, SPC and Statistical Analysis.

. Utilized Gantt Charts and Outlook for multi-tasking and monitoring of

the projects.

EXPERIENCE

Thermal Management Research Associate, SUNY Binghamton, NY

(May 2007 - May 2010)

. Enhanced the thermal performance of Impingement Parallel Plate Heat

Sinks by modifying fin shapes through extensive numerical modeling

integrating 3D CAD and CFD models.

. Employed Design of Experiments (DOE), FMEA and ANOVA principles for Fin

Shape Optimization.

. Research focused on Thermo fluids, Numerical Modeling and Heat

Transport applications.

. Performed simulations for Analog Devices, Inc., using FloTHERM to carry

out thermal analysis of Wire Bond Ceramic Chip Carrier and different

Wafer-Level Chip Scale Packaging (WLCSP) configurations dealing with

Natural Convection.

Thermal Analyst Intern, Endicott Interconnect Technologies Inc., NY

(June, 2009 - Sept 2009)

. Hands-on thermal characterization and testing of high performance flip-

chip packages using a cold-plate method by conducting experiments using

LabVIEW programming.

. Utilized ANSYS Icepak to perform a detailed parametric study to

investigate the effect of thermal parameters like thermocouple wire

attachment and displacement on the package thermal resistance.

HVAC Intern, Wheeling Nisshin Steel Inc., WV

(January, 2005 - June 2005)

Analyzed the boiler's efficacy and re-designed the existing steam

system resulting in energy savings.

EDUCATION

Master of Science in Industrial and Systems Engineering

(anticipated December 2010)

State University of New York at Binghamton, New York, USA

Advisor: Dr. Bahgat Sammakia, Professor and Director of S3IP, NY

Concentration: Optimization Study on Impingement Heat Sinks and Thermal

Characterization of a High-Performance Flip Chip Package.

Bachelors of Engineering (Honours) in Mechanical Engineering

(June 2006)

University of Hertfordshire, Hertfordshire, UK

West Virginia University, WV, USA [Study Abroad, Exchange Program]

(June 2004 - May 2005)

TECHNICAL SKILLS

FLUENT & Gambit; ANSYS Icepak; FloTHERM; Pro/E & Pro/Mechanica; Ansys;

Solid Edge; SolidWorks; AutoCAD; Inventor; SPSS; SAS; Matlab; Arena;

Minitab; LabVIEW; VB; C++; Gantt charts; MS Office

SELECTED PUBLICATIONS (2/4)

. Gondipalli, S., Sammakia, B., Gamal, R. A., "Improving the performance

of an Impingement Heat Sink by modifying the Fin Shapes",

InterPACK'09, San Francisco, CA, July, 2009.

. Gondipalli, S., Bhopte, S., Sammakia, B., Calmidi, V.V., "Numerical

and Experimental Study of the Effect of Thermocouple Wire Attachment

on Thermal Characterization of a High Performance Flip-Chip Package",

ITHERM 2010, Las Vegas, Nevada, June 2010.

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