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Mechanical Engineer Project Manager

Location:
San Jose, CA, 95136
Posted:
October 19, 2010

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Resume:

ALEXANDER KAGAN

*** ****** **

San Jose, CA *5136

********@*****.***

408-***-****

FIELD: PRECISION MECHANICS and OPTICS, ELECTRO-OPTICAL

INSTRUMENTATION, METROLOGY, and QUALITY CONTROL

JOB EXPERIENCE:

2007 - Staff Mechanical Engineer (R&D) NEW-WAVE

Research a division of ESI, Fremont, CA

Designed, developed, and tested:

. Accuscribe 2Z Laser Scribing System:

Dark field LED illuminator with Debris Removal assembly,

Switchable Magnification Block (1x-10x) with Remote Control,

Safety Shutter (smart power consumption, fit back sensors),

Autofocus System

. For the Flat Panel Display production:

Parallelogram Shutter for color pixel repair (4x Galil controller,

DC motors with encoders),

QL200 - Advanced Beam Delivery System (ABDS), which enables

precise cuts on a

microscopic level for each of the three wavelengths (infrared,

green or ultraviolet)

1997-2007 Staff Mechanical Engineer (R&D) KLA-

TENCOR, San Jose, CA

Designed, developed, and tested:

. Puma (Patterned Wafer Inspection system): Fourier Filter (FF) and

Variable Aperture Diaphragm (VAD). FF with new 2 sides rods parking

design, which allows increase area of aperture coverage in smaller

mechanism envelope. VAD - new component for different pixel size

applications

. Quantox Product Wafer (PW) - PW head assembly: Electrostatic Gun and

Atomic Force Probe for deployment and measurement electrostatic

charge on product wafer. Developed new shaker, probe (cantilever)

holder, probe adjustable mount and gun with purge option

. SpectraFx100 (Thin Film Measurement System - Spectroscopic

Ellipsometer): methodology and fixtures to focus ellipsometer's

components and to align spectrometer's slit (190 DUV option);

Thermo Shield: reducing the SpectraFx 100 final alignment

time in half for manufacturing

and service. Developed Service Manual. Support beta

release at customer sites

. High Resolution Profiler (HRP): inline dual magnification microscope

(one objective and three channels: 2.5x and 25x optical

magnification, auto focus channel, two CCD outputs);

steps for assembly process; tools and fixtures for assembly and

alignment

. Grazing incidence interferometer (NanoPro): prototypes for new

measurement cell with adjustable reference mirrors, wafer holder,

calibration mirror, and accessory for calibration

. For bare wafers (NanoPro): flipper stage for grazing incidence

differential interferometer (vertical "gravity force free" wafer

measurement position; edge support, 1mm edge exclusion; tilt, piston

- remote alignment; topography of both sides of the wafer

simultaneous measurement)

. For pattern wafers: measurement module and calibration fixture for

stress measurement system (non-contact optical probe with two light

sources and CDD output)

Performed stress analysis for wafer, base Theta drive, base

HRP-240 and motion analysis for flipper stage

1995-1997 Sr. Mechanical Engineer (R&D) PHASE METRICS, Fremont, CA

Designed, developed, and tested for disk testers:

. New Generation Certifier: lifterless low -Z loader with X-Y piezo-

drivers submicron resolution for head-gimbal assembly (HGA)

. MG250A (Burnish/Glide/Certification System): lifterless low-Z loader

with virtual point of rotation for the (HGA) - received patent; quick

disconnect for HGA with magnetoresistive (MR) head; screwless Z-block

for HGA with suspension type 2

1992-1995 Project Manager (R&D) MICRO-METRIC, San Jose, CA

Designed, developed, tested, and calibrated:

. Barform Chip Alignment Station to manipulate and bond a read sensor

chip into a shoe (six-axis precise positioning stages with a common

rotational center for pitch, yaw, and roll; non-contact optical

sensors with position-sensitive detectors; computerized beam position

measurement and alignment system with New Focus piezo-drivers

submicron resolution and stability )

. Software for calibration Micro-Metric Computer Aided Microscope:

Three axis coordinate measuring system under control of software

package for thinfilm head and wafer product (precision mechanical

stages, position encoders, control and vision systems up to

200x200x100mm)

1988-1991 Project Lead (R&D) Leningrad Optical and Mechanical

Enterprise (LOMO)

Designed, developed, tested, and calibrated the following automatic

measuring systems:

. Microscope with Auto-focus for the quality Control of IC lithography

masks and wafers (for CD and FT measurements)

. Comparator for the calibration of the end gages with small measuring

force, and Statistical Process Control (up to 100 mm)

. Probe for Coordinate Measuring Machine (CMM)

Participated in design and development of the software for comparator,

microscope, and CMM.

PROGRAMMING LANGUAGES and APPLICATION: Excel, Auto CAD, Pro-E, SolidWorks,,

WinLens

EDUCATION:

MS in Optical Instrumentation and Spectroscopy: The Leningrad Institute of

Precise Mechanics and Optics.

Post-graduate coursework and research in Measurement of mechanical

parameters: The Research Institute of Metrology (Ph.D. program)

Thesis: Non-contact Optical Measurements lithography masks for IC and

standard rings.

Pro-E training San Jose, CA

Solid Design (HP) training San Jose, CA

AutoCAD training San Jose, CA



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