Jorge (George) Miguez
408-***-**** / Santa Clara, CA 95050
****************@*******.***
SUMMARY
High potential Electrical Engineer with 16 years of experience.
Expert PCB designer with understanding of circuit design.
Experienced in managing and training teams.
Highly motivated, results oriented EE with extensive hands on
experience in high speed multilayer PCB layout. Team player, motivated self
starter, strong leadership and organizational skills. Good communicator.
Excellent problem solving abilities. Proven to deliver quality designs
ahead of schedule and within budget. Fast and effective at acquiring new
skills.
MAJOR ACHIEVEMENTS
* Key driver in doubling his employer's gross sales:
Took initiative to thoroughly study a transmitter circuit in order to
identify the sources of EMI.
Used that insight to design a PCB for a VCSEL fiber optics transceiver
that achieved the best performance on the market during EMI and EMC
tests.
The company's gross sales went from $10M to $20M in one year, based
largely on the success of that line of products. (OCP/Oplink).
* Greatly increased the efficiency and accuracy of the company's
design process:
Demonstrated leadership initiating and managing the transition of the CAD
system in use from AutoCAD to PADS.
Laid a strong foundation for the company's subsequent rapid growth.
(OCP/Oplink).
* Reduced manufacturing costs:
Skillfully redesigned PCBs using less layers than were used in previous
designs, typically 6 layers instead of 8, or 8 layers instead of 12. The
designs were compliant with IPC 6012 Class 3 requirements (used in
military, avionics and medical systems).
The cost of PCBs was reduced by a factor of 30%. (BAE Systems).
* Supervised and trained a team of CAD engineers performing PCB
design and development. (OCP/Oplink).
DEMONSTRATED WORKING SKILLS
PCB LAYOUT
Designed high density multilayer complex PCB layouts for experimental
and production use, performing at RF and high speed up to 10Ghz, requiring
the design of controlled impedances and length matching traces. Layouts
included analog, digital, mixed signal, power supplies, fine pitch BGA ICs,
surface mounted devices, thru-hole components, etc.
Maintained schematic symbols and PCB footprints
Generated complete documentation in support of manufacturing of PCBs
and PCAs (PCBAs): Gerbers, Drill Files, parts lists, BOMs, assembly
drawings.
Designed and modified MCM layouts.
(PADS PowerPCB, PADS Layout, AutoCAD).
TEAM WORK
Participated in all aspects of product life cycle including product
design, development, schedule, manufacture, and evolution in the market.
Collaborated with Mechanical Engineers to resolve power and thermal
management issues.
Collaborated with manufacturing specialists to reduce production costs
and improve product performance and reliability.
(Demonstrated Working Skills, continuation)
CIRCUIT DESIGN
Designed and modified digital, analog, mixed signal, power
supplies, and embedded systems using FPGAs, microprocessors, etc.
Performed troubleshooting and field testing of integration of
prototypes with other systems.
(Mentor Graphics PADS Logic, PADS PowerLogic, OrCAD).
EMPLOYMENT HISTORY
Electrical Design Engineer, BAE Systems www.baesystems.com (1 Year, Santa
Clara, CA).
CAD/Design Engineer and CAD Group Leader, Optical Communication Products,
(now OCP/Oplink) http://www.oplink.com/ocp/ocp_main.asp (8 Years, Woodland
Hills, CA).
Expert AutoCAD Operator, Sergio Zeballos Architect (1 Year, Santa Monica,
CA).
Design Engineer, ANTEL R&D http://en.wikipedia.org/wiki/ANTEL (7 Years,
Montevideo, Uruguay).
EDUCATION
MSEE, University of the Republic of Uruguay, 1988.
* Received the highest grade for a Master Thesis after designing
an embedded microprocessor based system (with analog interfaces for signal
conditioning, plus ADCs and DACs for A/D conversion) to acquire and process
traffic data from electromechanical telephone exchanges.
The design was sponsored and built by employer. (ANTEL).