Engineer Design
Resume:
T. JOE CRUZ
SIMI VALLEY CA. 93063
SUMMARY: PCB DESIGN
Seek to apply extensive experience as a hands-on in commercial and
military environment.
Encompassing all phase of electromechanical packaging and printed
circuit boards. A team
player that works with other personal on implement operating
procedures. General supervision
of other department staff as assigned.
The ability to communicate professionally, both verbally and in
writing
Detail orientated and self-starter
* Create Bills of Material using data to be used in all aspects of
manufacturing
Determining solutions for any technical problems within manufacturing.
* Implement internal and external ECO, ECR, and Deviations Red line
processes.
Experience working with MRP
Perform a variety of complex task
* Manufacturing liaison on fabrication and assembly of boards for
proof of etches.
Acknowledge of Workmanship Standards for Design IPC-600, IPC-A-610,
Surface Mount Land Pattern IPC-782 and IPC 2221/2222.
TECHNICAL
Assemblies may span the range of standard thru hole and surface mount
technology
Wire bonding in Microelectronics.
Materials, Processes, Reliability, and Yield.
PCB design with mechanical package, including Analog, High Speed
Digital Circuit, Flex Circuit,
and Microwave(RF) Design.
* Create/maintain/validate for all component library.
Systems tools use to automate design are Mentor Graphics DXDesigner and
Expeditions,
PCAD2004, ORCAD,CAM350 (Gerber data), and AUTOCAD (R14/2004).
PROFESSIONAL EXPERIENCE
* 2004 - 2009 CAD ENGINEER
G E Fanuc, Camarillo, Ca
Responsible for the design and documentation on new products, and
improvements on existing products, checking of
routing traces and layout placements. Acted as liaison to manufacturing
on all engineering pilot assembly.
. 2000-2003: DESIGN/PACKAGING ENGINEER 1995-2000
DESIGNER/SUPERVISOR
FIBERSPACE, Woodland Hills, Ca California
Microwave, Woodland Hills, Ca
1989-1994 PCB DESIGN SUPERVISOR 1981-1989: SR PCB
SPECIALIST
Seagate Technology, Simi Valley, Ca Pertron
Controls, Chatsworth, Ca
EDUCATION
SMT Technology Advanced SMT DESIGN
* Advance Mechanical Packaging for Flip Chip and BGA
CSUN 98.0 units towards B.S.E.E
Contact this candidate