Engineer Process

Wensheng Guo, Ph.D.

**** ****** **. ***: (***) 287 - 8229

(H)

Temple City, CA 91780 Email:

********.***@*****.***

SUMMARY

Senior Engineering Professional with 18+ years of working experience in the

field of microelectronics assembly and Thin Film Technology.

. In-depth knowledge of electronics and electronics packaging, optics,

thin film technology and metrology.

. Hands-on experience in electronic circuit design, assembly process

development, hybrid circuits/electronic parts screening and

qualification, reliability and failure analysis and corrective action

for high reliability products used in space, aviation, defense and

medical applications.

. Hands-on experience in various coatings and related deposition

technologies for telecommunication, biotech/medical, microelectronic

packaging and analytical instrumentation applications.

. In-depth knowledge of material science (Ph.D. major). Hands-on

experience in micro-fabrication including thin film deposition,

photolithograph, wet/dry etch, etc.

. Hands-on experience in process development and improvement using

Statistical Process Control (SPC) and Design of Experiments (DOE)

methodology for packaging and thin film coating applications.

. Wide-ranging experience and advanced knowledge of different types of

packaging technologies.

. Optical and Electro-optical instrument design skills from concept to

finished product.

. Negotiation experience with parts suppliers and customers.

. Excellent analytical problem-solving with strong computer skills.

. Research and Development Project Management experience.

PROFESSIONAL EXPERIENCE

Staff Packaging/Process Engineer Teledyne Microelectronic Technologies,

Los Angeles, CA 2006-2010

1. As the technical leader of Engineering, responsible for quotes, product

release, qualification and continuous improvement of high reliability

microelectronic packaged products for defense, space, aviation, medical

and industrial markets including:

a. Interfacing and negotiating with customers especially government and

military customers;

b. Writing technical proposals based on customers' Statement of Work and

technical requirement;

c. Translating program requirements into performance based hardware

requirements;

d. Conducting Critical Design Review (CDR) and Product Readiness Review

(PRR);

e. Final product qualification.

2. Technical leader of Optoelectronics product group. Current product focus

is high reliability optoelectronics products such as high power diode

lasers, fiber optic transmitters, receivers and transceivers.

3. Helped and recommended circuit design change, parts selection to our

customers to maximize productivity and reliability.

4. Hands-on experience in electronic parts screening and analysis using

various technologies such as XRF, OGP (parts dimension measurement

equipment), x-ray, Sonoscan, leak test, TEM, XRD, etc.

5. Existing packaging process monitoring and improvement such as thick film

substrate manufacturing, substrates attach, wirebonding, die/component

attach, plating, hermetic sealing, etc.

6. New process development, implementation, qualification and documentation

such as eutectic die attach for RF/Microwave components, MEMS packaging,

etc.

7. Conducted yield monitoring, reliability and failure analysis and

implementation of corrective actions.

8. Researched, recommended, purchased and optimized manufacturing equipment

for sputtering systems and other packaging needs.

9. In charge of daily operation of sputtering system used for thin film

metallization and fiber metallization.

10. Coordinated and conducted process development for RF/Microwave

amplifier products and high energy radiation detector used in space

environment.

11. Project Engineer for multiple programs.

12. Responsible for the R&D project of diode laser packaging for

biotech/medical applications.

13. Familiar with different types of packaging technologies such as Chip

Scale Packaging (CSP), Flip Chip, SOP (System on Package), SiP (System in

Package), etc.

14. Familiar with biocompatible conforming coating technology and materials

such as parylene used in microelectronics and medical device packaging.

15. Familiar with electroless/electrolytic plating for ceramic (Thick Film

substrate) and optical fiber metallization.

16. Familiar with laser welding, laser marking equipments and process used

for optical precision alignment or hermetic sealing of high reliability

products such as pacemakers, optoelectronics products.

Staff Manufacturing Engineer Coherent, Inc., Auburn, CA 2005 -

2006

1. Negotiated with customers; managed product releases and continuous

improvements of manufacturing processes such as optical components from

bulk material, fabrication, cleaning, thin film coating, metrology and

inspection to packaged product.

2. Designed and developed high laser damage threshold optical coatings for

applications of laser systems and other markets such as Infrared Imaging.

3. Experience with tasks such as ECRs, ECOs, MCOs.

4. Provided training, documentation and formal release of equipment to

production from R&D.

5. Managed every aspect of daily coating operation to ensure high quality

products with minimum costs.

6. In charge of coating chamber optimization; initiated and implemented

standardization resulting in significant yield improvement.

7. Recommended, designed and verified robust manufacturing tooling for

existing or new product lines.

8. Achieved process improvement by optimizing coating chamber in-situ

optical monitoring system, the system's capability increased from simple

AR coating to bandpass filter.

9. Process Development and improvement for new materials including metal

and dielectric materials.

10. Setup, troubleshoot vacuum deposition chambers and other equipment.

Characterized and monitored deposition processes, set up and maintained

associated metrology systems.

11. Re-developed the UV-VIS-IR spectrophotometers for specific

applications, achieving consistent and accurate measurements for very

tight product specifications.

12. Used coating techniques: IBS, E-beam, APS, thermal evaporation and Ion-

plate.

Thin Film Coating Process Engineer Auxora, Inc., Baldwin Park, CA

2001 - 2005

1. Conducted coating designs and successfully finished corresponding

coating process setup, development and improvement for telecommunication

applications.

2. Responsible for company coating manufacturing operation/daily

management.

3. Focused on process development and improvement using SPC and DOE. Made a

crucial contribution to the Auxora's Proprietary Technology - NanoCODETM,

which enables a consistent, predictable, and high yield manufacturing

process.

4. Achieved 200GHz and 100GHz tunable filters /linear variable filters.

5. Consistently designed and manufactured Gain Flattening Filters (GFFs) of

very complex spectra with small insertion loss error functions (ILEFs)

and very high yields resulting in "Auxora" as the dominant supplier of

GFF filters.

6. Developed high performance and high quality DWDM (200G, 100G and 50G)

thin film filters for long-haul telecommunication applications and other

specific filters for metro applications.

7. Identified, evaluated, purchased, implemented, and optimized various

coating and test equipment.

8. Applied technical expertise to solve process problems, optimize

processes, improve production yield and ensure products met customer

specifications.

9. Trained coating technicians/operators and provided both engineering and

technical support for coating manufacturing operation.

10. Responsible for troubleshooting vacuum deposition chambers and other

equipment.

11. Managed multiple R&D projects, finishing all projects on time and under

budget.

12. New Product development experience including optical coatings on fiber

taps and laser bars.

13. Used coating techniques: E-beam, APS, IBAD and IBS.

Associate Professor Information Optics Research Center, Sichuan

University, China 1997 - 2001

1. Obtained funding for 6 research programs related to laser induced damage

to optical thin films.

2. Developed various optical measurement systems for thin film

characterization.

3. Supervised 10 graduate students and taught graduate students courses:

Modern Optics and Thin Film Optics.

SKILLS

Optical Thin Film Design Software: TFCalc, The Essential Macleod

Optical Engineering Design Software: Zemax

Professional software: Agile, Filemaker Pro, Ingenuus, Matlab

Statistical Quality Analysis: Minitab

Standards: MIL-STD-883, MIL-PRF-38534, IPC-A-610E

EDUCATION

PhD - Material Science, Chinese University of Hong Kong, 1997.

MS - Optics Technology, Sichuan University, China, 1993.

BS. - Physics, Sichuan University, China, 1990.

OTHERS

Over 30 journal and conference papers.

Contact this candidate