Manager Engineering

Marion Ed Ellis

**** ********* *****

Pensacola, Florida 32504

Telephone: 850-***-****

Cell: 850-***-****

E-mail: **@**************.***, **********@***.***

Experience:

****-******* ***sult Ed Ellis, LLC

Pensacola, FL

Principal Consultant Electronic Materials, Components & Circuit

Manufacturing

I provide onsite and remote contract consulting services to electronic

components and circuits OEM's and related manufacturers. My services

include: New Product Development and R&D, material selection, process

specific electronic ink formulating, process identification, equipment

selection, characterization of printed electronic materials,

troubleshooting & problem solving of material and process problems,

manufacturing productivity improvements, six-sigma process engineering

including lean and agile manufacturing. Where applicable in providing

these services I employ Statistical Design of Experiments, Root Cause

Analysis and Shainin Statistical Engineering techniques.

Additional services include: capacity planning, PFMEA & DFMEA creation,

Intellectual Property identification & protection and SBIR proposal

preparation.

My specific areas of expertise include: formulating RoHs compliant LTCC

tapes & inks, multilayer hybrid circuits, thick film on metal circuits &

components, printing, firing/curing, soldering and thermal profiling.

Other areas of expertise include: particle size reduction and engineering

to meet specific product performance, formulation of glass frits and

organic media for specific rheological performance.

2001-2003 Paratek Microwave Inc. (Scanning Antennas) Columbia,

MD Senior Engineer (3 Direct Engineering Professional Reports, overall

responsibility 6)

As senior engineer I managed the R&D of printed electronic materials, their

manufacture, processing and created recipes employing engineered particle

sizes for specific performance for RF tunable capacitors designed for high

frequency (2 GHz and higher) broadband applications and voltage driven

sensors. My job duties also included: the definition, selection and

justification of capital equipment required, writing technical reports,

white papers, PFMEA's, DFMEA's and proposals and the preparation of SBIR

proposals as well as mentoring of junior engineers.

In addition I created effective business plans, budgets, and process

development plans, interfaced with and coordinated with materials

suppliers to obtain material property test data, and characterized

materials through performance and attribute testing.

1991-2001 Delphi Electronics & Safety (Hybrid Circuits) Kokomo, IN

Senior Project Engineer (Reports per project requirements)

As Senior Project Engineer I provided R&D for hybrid circuit materials from

the laboratory stage to conducting process and manufacturing engineering

activities for their pilot line programs and start of production. My

project responsibilities also included the definition, selection and

justification of the capital equipment required using as criteria design

for manufacturability, Lean /Agile Manufacturing.

Other duties and responsibilities included writing and organizing

materials specifications formatted for ISO qualification, interfacing and

coordinating with materials suppliers to obtain material property test data

through material characterizations and perform performance and attribute

testing.

Still other duties and responsibilities included the preparation of

PFMEA's, DFMEA's and the resolution of PPAP issues, the review of

legislative and regulatory proposals and actions to determine impact on

projects, the leading of continuous improvement efforts, and participation

in Manufacturing Technology Teams and other teams as needed, and the

writing of technical reports, proposals, technical papers for

presentation.

Still other duties included the initiation and evaluation of cost studies,

design proposals, (3) evaluation of competitor products, technical support

for solving production problems, coordinating overall engineering

activities with other departments, and training, developing and mentoring

junior employees.

1990-1991 Clarostat Company (Variable Controls) Dover, NH

Manager of Development Engineering (3 Direct Engineering Professional

Reports, overall responsibility 10)

As Manager of Development I managed and directed all Development activities

which included Design Engineering, Process Engineering, and Product

Engineering. I

created effective business plans, budgets, and process development plans,

defined cost reduction opportunities, initiated 6-Sigma quality concepts

and performed performance and attribute testing.

1988-1989 Allen Bradley Company (Resistor Networks) Greensboro, NC

Director of Engineering Thick Film Division (5 Direct Department Manager

Reports, overall responsibility 75)

As Director of Engineering I was responsible for all technology planning,

development and engineering activities in the U.S., Mexico and Singapore.

Reporting to me were 5 department heads, R&D, Product Development, Design

Engineering, Manufacturing Engineering, and Manager Ink Manufacture and

Commercialization. I planned and managed the engineering budget and had it

the "Black" for first time in history of the facility while implementing 5

new products and adjusting to declining sales of the core product .

1980-1988 CTS of Berne Corporation

Berne, IN

Director of Resistor Division R&D and New Product Development (5 Direct

Engineering Professional Reports, overall responsibility 20)

As Director of R&D and New Product Development, I managed and directed all

R&D and product development engineering activities from concept through

pilot line programs and start of production. I planned effective project

plans to meet timetables and business case justification. In addition to

the development of new electronic materials and products; these

responsibilities included: the identification, selection and justification

of capital equipment, engineering activities and corrective actions to meet

cost and scrap targets, the writing and organization of materials

specifications for TQS.

In the performance of these activities and responsibilities I traveled

extensively; interfacing with customers and material suppliers. This

information was used to define customer requirements & specifications and

obtain material property data. Other duties included, performance and

attribute testing to insure the resolution of quality issues.

1973-1980 CTS Corporation (Variable. Resistors, Resistor Networks)

Berne, IN

Manager Cermet Materials Division ( 5 Direct Engineering Professional

Reports, overall responsibility 30)

As Manager of Cermet Materials Division directed the manufacture and R&D of

all CTS Thick Film Materials which included, the identification, selection

and justification of capital equipment, engineering and manufacturing

activities to meet cost and scrap targets. I designed and implemented a

high volume electronic material manufacturing operation to produce 5 tons

of electronic materials and inks for electronic passive components and

sensors. The operation was complete with written materials specifications

for TQS.

I interfaced with customers and material suppliers in the obtaining of

material property test data and directed the performance and attribute

testing of all materials to prevent and resolve quality issues. In

addition I established a Technical Service team to service all users of CTS

Materials in the United States, Mexico, UK and Singapore.

Education:

1998-2002 Columbus University New Orleans, LA

International Doctor Jurisprudence. (Non-Practicing)

1970-1973 Indiana University Bloomington, IN

Masters Degree, Business Science.

1966-1970 Indiana University Bloomington, IN

B.S., Management & Administration (Industrial Engineering Core)

Skills:

Project Planning, Root Cause Analysis, Shainin Statistical Engineering, 6-

Sigma Engineering, Design of Experiments, Legal Writing, Computer (Excel,

Word, Project, Power Point)

Presentations, Publications, Patents, Trade Secrets and Special Awards:

Presentations

"Characterization of A Thick Film Piezoresistor Ink", Indiana IMAPS

Vendor's Day, April 27, 1998

"Materials, Method, and Process, Thick Film Sensor Cell On Stainless Steel"

Northern Illinois IMAPS Mini-Symposium, De Kalb, IL, April 23, 1999

"Thick Film On Stainless Steel Circuit Board", 32nd International Symposium

On Microelectronics, Chicago, IL, October 26-28, 1999

"Robust Process Window for Maintaining Resistor Balance During Production

Printing", Indiana

Publications

"The Electrical Resistance Circuit and Organizational Behavior",

International Journal for Hybrid Microelectronics, vol. 4, No. 2, p. 197-

203 10/81

"Infra-Red Firing of Copper Pastes in Nitrogen Atmosphere", The

International Journal for Hybrid Microelectronics, Vol. 5, No. 2, p. 86-91

11/82

"Computer Integration Does Away With Paperwork", Electronic Packaging and

Production Magazine, Vol. 25, No. 2, p. 226-229 2/85

"Process Specific Thick Film Materials", Hybrid Circuit Technology

Magazine, Vol. 7, No. 11, p. 21-25 11/90

"Fast Sinter Thick Film Resistor Compositions", Proceedings: 31st

International Symposium on Microelectronics, San Diego, CA, 11/98 awarded

"Best Paper of Session"

"Fast Sinter Thick Film Resistor Compositions (Revised)", International

Journal of Microelectronics & Electronic Packaging, 4th Quarter 1998

"Thick Film On Stainless Steel Circuit Board", Proceedings 32nd

International Symposium On Microelectronics, Chicago, IL, October 26-28,

1999, awarded "Best Paper of Session"

"Robust Process Window for Maintaining Resistor Balance During Production

Printing", Proceedings 33rd International Symposium On Microelectronics,

Boston, MA, September, 2000

"Thick Film on Stainless Steel; Applications, Methods and Processes",

Proceedings 33rd International Symposium On Microelectronics, Boston, MA,

September, 2000

"Factors Affecting Characteristics of Thick Film Voltage Tunable

Dielectrics", 2003 Ceramic Interconnect Technology Conference, Denver, CO,

April, 2003

Patents

"Resistance Composition and Method of Making Electrical Resistance

Elements", U.S. Patent # 3,916,037, Issued 10/28/75, Assignee CTS

Corporation, Elkhart, IN

"Apparatus and Method for Producing Uniform Fired Resistors", U.S. Patent #

4,4338,351, Issued 7/6/82, assignee CTS Corporation, Elkhart, IN

"Method of Producing Uniform Fired Resistors", U.S. Patent # 4, 469, 044,

Issued 9/4/84, Assignee CTS Corporation, Elkhart, IN

"Method for Forming Thick Film Resistors and Compositions Therefor", U.S.

Patent # 5,463,367, Issued 10/31/95, Assignee Delco Electronics, Kokomo, IN

"Segmented Thick Film Resistors", U.S. Patent # 5,621,240, Issued 4/15/97,

Assignee Delco Electronics, Kokomo, IN

"Dual-Solder Process for Enhancing Reliability of Thick-Film Hybrid

Circuits", U.S. Patent # 5,803,344, Issued 9/8/98 Assignee Delco

Electronics, Kokomo,, IN

"Diffusion-Barrier Materials for Thick Film Piezoresistors and Sensors

Formed Therewith", U.S. Patent # 5,898,359, Issued 4/27/99, Assignee Delco

Electronics, Kokomo, IN

"Metal Diaphragm Sensor With Polysilicon Sensing Elements and Methods

Therefor", U.S. Patent # 6,022,756, Issued 2/8/00, Assignee Delphi

Automotive Systems, Kokomo, IN

"Method for Ruthenium-Based Thick-Film Resistors", Patent # 6,180,164

Issued January 30, 2001, Delco Electronics Corporation, Kokomo, IN

"Method of Forming Thick-Film Hybrid Circuit on A Metal Circuit Board",

Patent # 6,233,817, Issued May 22, 2001, Delphi Technologies, Troy, MI

"Method of Forming Integral Passive Electronic Components on Organic

Circuit Board Substrates", Patent # 6,631,551, Issued October 14, 2003,

Delphi Technologies

"Spark Plug Mounted Thick Film Strain Gauge", Patent #6,679,100, Issued

January 20, 2004, Delphi Technologies

"Spark Plug Mounted Thick Film Strain Gauge", Patent #6,834,538 B2, Issued

December 28, 2004, Delphi Technologies

"Tunable Dielectric Compositions Including Low Loss Glass". Patent #

6,905,989, Issued June 14, 2005, Paratek Microwave, Inc

Trade Secrets

"Vertical Network Screening Apparatus", 7/22/82, CTS Corporation, Elkhart,

IN

"Vertical SIP Chip Carrier", 6/18/84, CTS Corporation, Elkhart, IN

"Dynamic Optimization of Firing a Thick Film Resistive Paste", 5/24/85, CTS

Corporation, Elkhart, IN

"Organic Coating for Thick Film Resistor Networks", 2/12/86, CTS

Corporation, Elkhart, IN

"Copper Conductive Paste for Edge Metallization for Thick Film Resistor

Networks", 3/14/86, CTS Corporation, Elkhart, IN

"High Gain - High Stability Thick Film Piezoresistor Compositions",

7/19/00, Delphi, Kokomo, IN

"A Thick-Film Capacitor Structure", 8/10/01, Delphi Delco Electronics

Systems

Special Awards

Delphi Automotive Systems' "Boss" Kettering Award for 1999, Opel "Y" Engine

Control Module using Via Definition Rings and Dense Pack Resistors.

Delphi Innovation Hall of Fame, Induction September 7, 2001

Delphi Innovation Hall of Fame, Bronze Award December 1, 2010

Contact this candidate