Design Engineer
Resume:
Bellport, N.Y. 11713
Home Phone 631-***-****
Cell-602-***-****
********@*********.***
OBJECTIVE: TO obtain PCB Design position
QUALIFICATIONS:
My background and strengths as a PCB and Mechanical Designer for over
20 years. Capable of designing Complex High Speed Multilayer PC
Boards, Flex, Chip on board, Asics design RF,MIXED. I am responsible,
out going, and a team player, self motivate which would make me a
great asset to the Co. I can learn any software fast and effectively
.
EDUCATION:
2007-2010 Steve Winderm training Autodesk Inventor-2007-2010
1993-2010 DxDesigner/PADS -Mentor Graphics
2006-2007 Autodesk land desktop 3d Pentacor
2004-2005 AZ. Tech Institute Copier School, Tempe, AZ.
2000- PCB Design Conference West, Santa Clara, CA Flex
circuits, Surface mount, Mixed Signal
1998- PCB Design Conference West, Santa Clara, CA
Design for Test, Micro via, Blind and Buried Via
1996- PCB Design Conference West, Santa Clara, CA (High
Speed Design)
1987. Farmingdale College, Long Island, N.Y.
1983. Island Drafting and Technical Institute, Amityville N.Y.
EMPLOYMENT:
2007-2010 Brookhaven National Lab, UPTON N.Y. DEPT-NSLS-II
CHIP ON BOARD, ASICS DESIGN
Design PCBs from Engineering notes
Generate Schematics, Bill of
Materials, create Schematic Logic
Symbols, and PCB Footprints for end user
High Speed, multilayer, RF, Digital,
DSP, Flex, Analog, Power amp Printed Circuit Bd.
Sheet metal designs using
Inventor 3d 2010 and Autocad 2010
Electro Mechanical Design 19"rack Power
Supply Systems, Power distribution
Module's using Inventor 3D 2010
Autodcad. 2010. Reference's upon request.
2006-2007 Cad Tech Drafting Pentacor Inc. Scottsdale AZ.
Civil Design and Drafting using AutoCad
Civil Land Desktop 2005
Drafting, Site plans, Topos, Surveys,
Reference's upon request.
2003-2009 Design Engineer 6D Design Phoenix, AZ.
Contract Work
Design PCBs from Engineering notes
Generate Schematics, Bill of
Materials, create Schematic Logic
Symbols and PCB Footprints for end user
High Speed, complex multilayer RF,
Digital, Analog Power amp PCB.
Sheet metal designs using
Autocad 2000. Reference's upon request.
2005-2006 Availe Inc. Tempe AZ.
Fix and repair; Printers, Fax Machines,
Copiers.
2001-2003 Design Engineer Amkor Technology Chandler,
AZ.
Chip DESIGN Responsibilities;
Design Substrate from Die Asics
Stack Die for wire bonding
CABGA, PBGA, and CTGBA Flex software used
IC Packager CAM350
Assembly and Fabrication Drawing's using Autocad 2000. Reference's
upon request.
1984-2000 PCB. Designer, Brookhaven National Lab,
Upton, N.Y. Ref. John Bohenek Supervisor
From Engineering notes and general instructions, generate
Schematics, Bill of Materials, PC Boards and Sheet Metal
Dwg's. Incorporated ECO's into jobs when required. Worked on
Power Supply, Analog, Digital, RF and High Speed Impedance
controlled PC Boards.
SOFTWARE SKILLS:
Operating Systems:
Dos
Windows NT
Windows XP
Windows 7
CAD Software:
Inventor 2010
DxDesigner/Pads flow 9.1
IDF-MODEL 2010 PADS TO INVENTOR 3D
ASSEMBLY
PADS ADVANCED CHIP ON BOARD 9.1 PADS FLOW
Visio
Autodesk -2010 Inventor 3d
AutoCad 2010 Mech.-desktop
AutoCad Land Desktop 2005-2007 3d
Revit 3d Architect Design
Mentor Graphics DxDesigner-Pads
LPWIZARD 2010
Pads Power Logic Schematic capture
Spectra Router SP40 (for Pads PowerPCB)
Pads Blaze Router
Pcad
Schema
Zuken IC Packager
Computer Vision
Cam350
Microsoft Office Products (Word, Excel, Power Point)
Hobbies: Keyboard player, motorcycles riding, Muscle car collector,
weight training, running
Contact this candidate