Manager Design

Igor

Rozinsky

*** *********

Circle St.

Minnetonka, MN

55305

Cell: 952-686-

4639

E-mail:

abh0b4@r.postjobfree.com

OBJECTIVE: Printed circuit board designer position.

QUALIFICATIONS:

. Possesses strong expertise in all stages of PCB Design - from schematic

capture to producible printed circuit board.

. Skilled in different types of PCB designs from simple to complex multi-

layer boards, including digital, analog and mixed technology, high-speed

with impedance control, numerous matched length of traces, differential

pairs, RF,

power supplies, through-hole & SMT with high pin-count and fine-pitch

BGA (ball grid array) packages, flexible & rigid-flexible with via-in-

pad technology,

boards with buried & blind via, boards with micro(laser)-via, with

requires panelizing.

. Extensive experience in designing high density PCB with SMT components

on both sides and PCB prepared for auto-testing process(ICT).

. Strong knowledge in designs driven by complex business rules.

. Expertise in creating and maintaining PCB libraries (footprints) for the

company.

. Working knowledge of IPC standards.

. Broad experience in CAD layout using Mentor Graphics BoardStationRE &

Expedition & PADs, Cadence Allegro & Orcad, Altium, CAMCAD, CAM350,

Autocad, and other programs.

. Knowledge of printed circuit fabrication technology & assembly process,

interpretation of electrical schematics, chip functionality,

mechanical drawing

and part specifications.

. Experience in transfer of manufacturing outputs to PCB vendors for board

production and acted as a liaison for vendors to resolve issues with

designs.

EMPLOYMENT:

1995 - Present Argo PCB Ltd., Hadera, Israel

Position: Senior PCB designer/Contractor.

Worked as an independent contractor for more than

12 years.

Provided cost effective, high quality design

services for

electronic companies.

Major clients include: Philips, Intel, Telrad, Scitex,

Variscite, Optibase,

Vbox and others.

. Was responsible for design of super large PCB for Philips with

the following specifications:

Number of layers: 24

Dimensions: 519mm X 206mm,

Number of components: 4595 including 3 672-pins BGA- package

components

Number of connections: 14360 including more than 800

differentials

pairs with impedance control and 300 matched length

traces

Implementation has been done utilizing electrical

constraint manager,

auto-router, reusable block options of Mentor

Graphics

BoardStationRE.

. Another project for Philips required designing large PCB with

the following specifications:

Number of layers: 22,

Dimensions: 472mm X 110mm,

Number of components: 2595 including five 896-pins BGA-

package components

Number of connections: 9713 including differential pairs,

clocks,

with impedance control and matched length

traces.

Implementation has been done utilizing auto-

router of Mentor Graphics

BoardStationRE.

. Responsible for design of rigid-flexible PCB with complex

mechanical configuration for Philips containing 16 layers,

with fine-pitch BGA 86-pins and 256-pins on both sides of PCB,

differential

pairs with impedance control, with laser-vias.

. Responsible for the design of PCB for Variscite implementing

via-in-pad technology with laser-vias. The12 layer board

complied with

high density manufacturing requirements (HDI: 3 mil - width

of trace and 3 mil - space between traces), RF traces and

included special CPU - fine-pith BGA with 0.5mm between

pins.

1991 - 1995 PCB design services corporation, Haifa, Israel

Position: PCB designer

1977 - 1990 Electronic Corporation, Kharkov, Ukraine

Positions: PCB designer, Electromechanical

Packaging designer,

Senior PCB designer

EDUCATION:

1971 - 1977 Kharkov Polytechnical University, Ukraine.

Master's degree in Electronics Engineering,

Training:

1991 Israel Institute of Technology (Technion), Haifa,

Israel.

Advanced Electronics Engineering

2001 Mentor Graphics, Herzliya, Israel.

PCB RE AUTOACTIVE

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