Engineer Process
Resume:
JAMES J. KALIVODA
Albuquerque, N.M. 87114
home: 505-***-****
cell: 505-***-****
Email: *********@***.***
SUMMARY
Process engineer with 21 years of experience in the semiconductor industry in a high-
volume
manufacturing environment, with an additional 3 plus years of experience in a Research
and
Development facility. Experienced in 100mm, 150mm, and 200mm factories.
Demonstrated
technical and team-oriented skills. Able to align work to accomplish organizational
goals.
Skilled at communicating with and developing workers through training, self-
management, and
team leadership. Strong knowledge of DOE, SPC, HPM, lean manufacturing, etc.
PROFESSIONAL EXPERIENCE
SANDIA STAFFING ALLIANCE, Albuquerque, New Mexico 6/2008- current
Contract Process Engineer working in various project groups within the Sandia uFab
area,
including PIC (photonics integrated circuits), HBT (heterojunction bipolar transistors),
and most
recently WLP (wafer level packaging). Certified to use most all equipment contained in
uFab
including RIE etchers, CVD, TEMS metal deposition tools, contact mask aligners,
spin/stepper
litho tools, measurement tools, wet benches, RTA, ion beam etcher, etc. Some process
development work, specifically RIE dry etch, as part of PIC activities. Obtained security
clearance level “L”.
L&M TECHNOLOGIES, Albuquerque, New Mexico 2/2008-6/2008
Employed as contract Process Engineer/Micro technologist to Sandia National
Laboratory,
working in the Microsystems area, specifically the photonics group, building micro lasers
on
various substrate materials.
INTEL CORPORATION, Colorado Springs, Colorado 5/2004-12/2007
Ion Implantation Process Engineer
Tool owner for Varian E1000 and Applied XR80 tool sets. Contributing member on
many
teams oriented towards product yield and equipment up time.
* Key activities as part of new process transfer involved tool modifications and quals
(XR80 Leap 1 to Leap 2).
* Led ATAC activity to drive defect levels to much lower levels needed for new process.
Results: Drove qualifications to completion to meet tight schedule requirements for
new product transfer.
PHILIPS SEMICONDUCTORS, Albuquerque, New Mexico 3/1986-9/2004
Ion Implantation Process Engineer (2000-2004)
Maintained process controls on Varian 300xp, 160xp, Kestrel and E500 tools, and on
Applied
9500 tools on diverse line of processes, including CMOS, BiCMOS, NMOS and Bipolar.
Monitored both in-line and end-of-line process controls via Cpk measure. Verified tool
matching with respect to dosing and energy parameters. Involved heavily in problem
solving via
8-D, FMEA, Lower Break Even, Tool Performance Improvement and other team-
oriented
activities. Supported 200mm activity.
* Successfully qualified new Varian Kestrel II implanter from install to ready for
production stages.
Results: Increased capacity by almost 20%; also reduced cycle time from days to hours
on series of chain implants for several different processes.
* Made process improvements based on experimental data. For example, implemented
machine control.
methodologies to improve incapable low-energy process previously deemed not valid.
Results: Near elimination of 5% scrap rate and capable process as measured by Cpk.
* Established Western Electric rules to detect trend violations
* Instituted new monitor system (TWAVE) to reduce qualification time.
* Updated all written specifications for area.
Diffusion and Wets Area Process Engineer 1998-2000
Transferred CMOS, NMOS, and Bipolar processes from 100mm factory to 150mm
factory.
Adjusted process modules as needed to fit product needs to new tool sets in both
diffusion and
wets area.. Experienced on Thermco furnaces, recipe writing, and equipment trouble-
shooting.
Improved processes through designed experiments and data analysis using Excel,
Datapower,
and RS1.
* Qualified and made capable via process module changes boron nitride solid source
process unique to 150mm factory.
Results: Product delivered to customer performed to same level and was of same
quality as that produced in 100mm factory.
* Qualified FSI wafer cleaning tool for 150mm wafers.
Results: Allowed for same equipment to be used on selected processes until such time
that alternative tool set could be qualified.
* Proposed numerous control methodologies for 150mm diffusion area.
Results: Implementation of normalized control charts for diffusion processes.
Reduction in test wafer usage by taking measurements on actual product.
Diffusion and Implant Process Engineer 1992-1998
Diffusion:
* Extensive knowledge on all diffusion processes; wet/dry oxidation, LPCVD, PECVD,
POCL3 dope, solid source dope, plus extensive hands-on troubleshooting.
* Used designed experiments and Cpk measures to make process and yield
improvements
* Put in place surface charge analyzer used to detect metallics in-line that could result in
yield loss
* Maintained and improved wet processing on FSI tools. Reduced chemical usage to
reduce costs.
* Trained fellow engineers, technicians, and manufacturing staff to troubleshoot
equipment.
Implant:
* Worked on poly-on-oxide wafer for in-line measure used to detect charging..
* Maintained tool matching with respect to delivered dose and end-of-line results.
* Although limited experience in the epi area, implemented monitor used to detect
metallic contaminants (SCA).
Engineering Technician 1990-1992
* Sustained all diffusion, implant, and thin films equipment and processes on compressed
shift. Bruce furnaces, FSI wafer cleaning tools, metrology equipment, Varian and
Eaton implanters, Applied 2100 glass systems, MRC metal sputter tools.
Manufacturing Specialist/Diffusion Area Coordinator 1986-1990
EDUCATION
Bachelor of Science, Biology, New Mexico State University, 1983.
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