WILLIAM P. BOWMAN (Willy)

503-***-**** * abgvm7@r.postjobfree.com

*** ** ***** ******, ********,

Oregon 97225

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SENIOR EXECUTIVE: Semiconductor Manufacturing Operations * Engineering

*Supply Chain Management

Building and Leading World-Class Manufacturing Operations Teams, Flexible &

Responsive Supply Chain Strategy and Partnerships, Continuous Improvement

of product cost, quality and lead times.

Resourceful executive with a career-long record of innovation and

results, leading operations and engineering within large and small multi-

national corporations with rapidly changing and highly competitive

environments.

Semiconductor product costing, margin analysis, supplier negotiations,

cost reduction strategies and their implementation. Consistently

delivered results which met or exceeded goals by coaching and working

hands on with supply chain partners, direct reports and their staff to

clearly understand the priorities and objectives.

Reputation as a tough but fair supply chain manager supported by

partnerships that we can truly rely upon.

P&L responsibility at the operations level. Extensive and Valuable

International supply chain network.

In depth background and experience in Semiconductor Product, Test, and

Package Engineering (Including Copper wire development), as well as

Quality and Reliability.

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EXPERIENCE AND ACHIEVEMENTS

Lattice Semiconductor Corp.: Hillsboro, Oregon / *Singapore

$325M fabless semiconductor company that designs, develops and markets

Programmable Logic Devices (PLDs) for a wide variety of consumer,

industrial, automotive and military applications

Corporate Vice President - Manufacturing Ops & General Manager of

Lattice SG Pte. Ltd. Jan '10 - Present

Oversee all manufacturing operations including Foundry, Product, Test

and Package Engineering, Planning, Production Control, Shipping, Wafer

Foundries and Subcontract Assembly & Test Partners with P&L

responsibility at the Operations level. Drive operations for continuous

improvement in COGS, cycle time, quality and customer delight.

Significant Accomplishments:

o Led Japan crisis response team after March, 2011 disaster to

successfully minimize impact of wafer and assembly supply chain

issues on Q1 and Q2 customer deliveries.

o Established a new Manufacturing Operations Site in Singapore in

January of 2010 and transferred 90% of the product sustaining and

cost reduction related responsibilities to the new team by Q3

2010.

o Transitioned from Engineering to overall Manufacturing Operations

management and led the team though one of our most rapid

manufacturing ramps in history while still improving costs and

margins and with no significant impact to customer on time

delivery commitments.

Q309 Q409 Q110 Q210 Q310 Q410 Q111 Quarterly Sales ($M) 49.097

55.087 70.432 77.119 77.137 73.131 82.615 Mfg. Margin 54.2%

55.4% 58.5% 61.2% 59.1% 62.8% 60.0% On Time Delivery 98.3% 97.8%

98.1% 98.0% 98.0% 98.4% 98.3% Net Income ($M) -4.1 5.612 11.089

16.736 15.544 13.703 10.919

o Instrumental in our successful turnaround and return to sustained

profitability, implementing significant restructuring initiatives

in Operations, establishing the new Singapore operations team,

while continuing to stay focused on cost reduction and customer

delivery priorities.

o Successfully managed the Manufacturing Operations team from

offshore (Singapore) for the first time in Lattice History.

o Significantly improved supply chain partnerships with Foundries

and Assembly Test suppliers through more straightforward

negotiations and execution on all commitments, resulting in

improved costs, quality and cycle time performance.

o Refined supply chain price negotiations strategy by working

closely with internal Business Units to clearly understand which

areas we should focus on for maximum sales and margin impact.

William P. Bowman

503-***-**** * abgvm7@r.postjobfree.com

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Vice President - Manufacturing Engineering, Lattice Semiconductor

(Continued) Aug '06 - Dec '09

Oversee manufacturing engineering function including Product, Test and

Package Engineering. Subcontract Assembly & Test Partnerships Strategy

and Management. Drive Engineering and subcontractors for continuous

improvement in Yields, Cycle Times, Test Time, Quality and Costs.

Significant Accomplishments:

o Responsible for Subcontract Assembly & Test supplier strategy,

selection, contracts and negotiations.

o Led all engineering initiatives associated with supporting

these partners

o Led Yearly price negotiations with all Assembly / Test

suppliers for average reduction of 7%/year.

o Developed and deployed massively parallel wafer sort (40 site) and

final test (8 site) on our high volume embedded FLASH CPLD

products reducing test costs by more than 70%.

o Led product and test engineering teams to successfully develop

yield evaluation tools for 180, 130, 90, and 65nm products.

o Tools have been instrumental in the rapid identification and

elimination of yield limiting process defects in order to

achieve world class defect density levels.

o Led engineering effort in partnership with the Quality team to

complete AEC-Q100 qualification of

4 product families for Automotive use and achieved TS-16949

certification for our facility

o Key Manufacturing team member to drive implementation of the new

Product Life cycle Management approach for new product development

from feasibility through discontinuance.

o Cost estimation of all proposed new products to help determine

feasibility and for current products to establish product pricing

targets .

o Successfully developed and qualified ROHS compliant QFN's, saw

singulated LBGA's (0.4, 0.5, 0.8 & 1.0mm ball pitch), Flip Chip

BGA's. Also qualified Copper wire LQFP and BGA packages.

Director - Manufacturing Engineering, Lattice Semiconductor

May '97 - Jul '06

o Developed the product costing and margin analysis system for

Lattice, including all forward looking cost estimates for new and

current products.

o Cost reduction and all manufacturing margin improvements through

sort, assembly and final test yield improvements, as well as test

cost reduction and subcontractor pricing negotiations.

o Manufacturing integration of acquired product lines:

o Vantis CPLD and PAL product lines, which we purchased from AMD

in 1999.

o Agere ORCA FPGA and FPSC product families acquired in January

'02

o Transferred all products to our preferred sort, assembly and

final test sites.

o Converted test to more cost effective platforms and improved

margins on these products from < 20% to > 60%.

o Successfully doubled the size of the product, test, and assembly

engineering groups and minimized the turnover in previously

turbulent departments.

o Led the team responsible for corporate selection of all tester

platforms to be used for all products in development and

production.

o Successfully developed and qualified Power Quad QFP's, Thermally

Enhanced BGA's, & PBGA's (1.0 and 1.27mm pitch)

ST Microelectronics: Carrollton Texas / Phoenix, Arizona

Multi-Billion Dollar Semiconductor company (#8 in '97) serving all

electronics segments

Director of Engineering & Product Development, PC-Micro Division, New

Ventures Group Sep '93 - May '97

The PC-Micro division of ST Microelectronics was a $100M+/year x86

Microprocessor business.

o Managed the successful start-up and qualification of wafer probe,

final test and burn-in manufacturing areas for the new Phoenix

facility.

o Managed the timely process qualification of five new 0.6 and 0.55u

HCMOS processes in four separate wafer fabrication facilities

worldwide.

William P. Bowman

503-***-**** * abgvm7@r.postjobfree.com

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Director of Engineering & Product Development, ST Microelectronics, PC-

Micro Division (continued)

o Overall Project Management responsibility (including 3rd party

design company) for a new 0.25u 7th generation microprocessor.

o Directly responsible for all product cost reduction through Yield

Improvement and manufacturing cost reduction activities,

effectively reducing costs for the 486 products by 60% in less

than nine months.

o Successfully managed the package development and qualification

activities for all Ceramic and Plastic Pin Grid Arrays, Plastic

QFP's, Plastic Ball Grid Arrays and Flip Chip Packages.

Zilog Incorporated: Nampa, Idaho

Feb '93 - Aug'

93

Product / Test Engineering Manager, Front End Operations: Z8 Z80 and

Z8000 microcontroller products

o Was able to effectively double the average wafer probe yields for

all products in less than 7 months with simple tools (dead zone

analysis of stacked wafer maps) and procedures.

o Led the reorganization of engineering group to better handle the

split between Yield Improvement and general sustaining issues at

wafer probe.

o This included setting up a separate sustaining operation team,

which operated during nights and weekends.

ST Microelectronics: Carrolton, Texas

Dec '87 - Jan

'93

Engineering Manager, Semi-Custom Products, Programmable Products Group

o Managed the timely process qualification of three new Standard

Cell and Gate Array product families using double and triple

metal, sub-micron processes.

o Manufacturing margin improvement through test time and yield

improvement.

o Managed package development and qualification activities for

Ceramic and Plastic PGA, PQFP, and PBGA Packages.

o Developed and maintained all test capacity models and led next

generation Tester platform selection team for our division.

VLSI Technology Incorporated: Tempe, Arizona / San Jose, California

Jun '84 - Nov '87

Senior Product Engineer, Government Products Group / Memory Products

Group

o Instrumental in the start-up of the Tempe, Arizona Government

Products Engineering department and new test facility.

o Evaluation of back-end (test and burn-in) equipment

manufactures

o Package development and qualification.

o Documentation of all backend procedures.

o Development of approximately 60 Military ASIC prototypes and

release of 8 designs to MIL-STD-883 compliant production.

o Developed 3 high density ROM's, 2 Dual Port RAM's and a high speed

64K EEPROM.

EDUCATION:

o Bachelor of Science in Electrical Engineering (BSEE), 1984

Cornell University, Ithaca, New York

o Six Sigma Lean Manufacturing, Product Life Cycle Management, Team

Oriented Problem Solving, Statistical Methods for Improving

Process Control (SPC), Project Management, Design of Experiments

and Total Quality Management

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