Engineer Design

Charlie Nguyen

************@*****.*** 214-***-**** U.S. citizen

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*** ********* ***** ****** ** 75094

SUMMARY

To obtain a position as test product engineer in electronic industry where I can utilize technical

knowledge, experience of analog, digital, mixed signal, RF/microwave device.

TECHNICAL SKILLS

• Analog: ESD/EMI protector, LDO switch regulator, OP-Amplifier, DTMF transceiver.

RF/baseband: LNA amplifier, Mixer, Power amplifier, VGA, Filter, DA/AD converter.

Microcontroller: 8-32 bit MCU emphasis on 8 bit PIC and 32 bit V850 microcontroller.

• Hardware equipment: LTX-Credence, Teradyne, Keithley. Test instrument: curve tracer,

semiconductor parameter, network analyzer, spectrum analyzer, signal-generator,

oscilloscope, logic-analyzer, frequency counter, current source meter, and power supply.

• Operate system: Window, Unix, Linux; Statistical tool, Cadence, Synopsis, Nova, Spice.

• Software language: C, Basic, Assembly, Verilog, Matlab, Labview, Visual Basic, C++.

PROFESSIONAL EXPERIENCE

Renesas Inc. merged with NEC Electronics Inc. Irving, Texas, 01/2007 – 11/2012

Test Development Engineer Sr. & Design Engineer

• Involved architect, schematic, plan verification, RTL, gate simulation, pattern generation.

• Implemented test patterns in IG-XL programs for V850 microcontroller.

• Verified functional patterns included memory test, logic flow, & test time.

• Checked sort flow accuracy, stable, and repeatable on Teradyne ATE tester.

• Characterized AC, DC, and ADC electrical parameters correspond with spec.

• Modified single DUT schematic into parallel multi-site to build hard-ware board.

Microchip Inc. Chandler, Arizona, 09/2004 – 01/2007

Test Sustain Engineer

• Interfaced design, development, yield improvement, application, production, FA, and QA

• Maintained, modified wafer sort, final test patterns, source programs PIC microcontroller.

• Generated, implemented patterns’ assembly code, IG-XL visual basic on Teradyne tester.

• Monitored sustain activity included product yield enhancement and test time reduction.

• Converted window C KELOQ software to visual C++ to validate manufacture code.

Intel Corp. Chandler, Arizona, 09/2003 – 09/2004

Validation Contract Engineer

• Documented test methodology plan. Validated COB chip ‘wireless transceiver’ on board.

• Set bench microwave equipment up, characterized, analyzed analog, RF test parameters.

• Created IBIS memory model based on VI, VT buffer characteristic on BGA package.

• Compared data between actual scope measurement and behavioral TDK simulation.

CAMD Corp. acquired by ON Semi. Corp. Phoenix, Arizona, 04/2000 – 09/2003

Test Product Engineer

• Wrote analog mixed-signal test plan, wafer sort, final program on LTX-Credence tester.

• Performed IC device characterization, chip qualification accordance with specification.

• Debugged silicon wafer, packaged chip finally released test software to production.

• Correlated DUT measurement data between hardware ATE tester and test bench.

• Evaluated ESD, latch-up. Generated, maintained ECO assembly document.

EDUCATION

BS, Electrical Engineering, University of California, Davis, December 1999

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