CURRICULUM VITAE
Name: Luis Raul Ramirez Juarez
e-mail: ********@*****.***.**;
Please ask for mail my phones
Skype: luisraul.ramirez.
PROFESSIONAL OBJECTIVE
To efficiently solve manufacturing and production challenges, to ensure
continuous plant operations, and to contribute to profitability by
identifying and implementing cost reduction measures and quality
improvements.
EDUCATION
2002 - 2004 Master of Science in Manufacturing (Gestion de Negocios
de Manufactura)
Universidad Americana del Noreste.
www.uane.edu.mx
Graduated by average
H. Matamoros, Tamaulipas. Mexico
Jun 94 - Oct 00 BSc. Electronics Engineering with specialization in
digital systems
Instituto Tecnol gico de San Luis Potos .
www.itslp.edu.mx
Thesis Title: Redesign of the Control for a manipulative
robotic arm
San Luis Potosi, Mexico
WORK EXPERIENCE
Aug 2010 to Nov 2012. Johnson Controls, Reynosa 1 & 2.
Hired as initially as Sr. process engineer in charge of
developing projects across the plant such as cost
reduction project, ergonomic improvements and lean
manufacturing initiatives, workstations design, device
redesign using Autocad or MS Visio and develop work
instruction for electric control panel lines and
improvement projects on the pneumatic assembly valves
lines and support on fauilure analysis. Green belt
project: the electronic humidity sensor yield increase
from 66% to 85%. Transference of the capacitive sensor
to Mexico.
Main achievements:
I manage projects that sustain manufacturing and improve
it to a professional manufacturing level, by applying
lean manufacturing concepts, therefore redesigning for
smaller/space-efficient/ergonomically workstations, as
result of this, I was chosen to transfer all lines from
plant 2 to plant 1 and I was also given with
responsibilities layout/transfer lines on both plants in
Reynosa as an advance manufacturing engineer. Reynosa
was chosen as the benchmark plant for the panels
manufacturing as I showed off my workstations designed
for ergonomics in the global JCI benchmark event. I
relayout the valve machining valves plant and released
90k SQF.
April/May 2010 Littelfuse / Concord Semiconductor Co limited
(Wuxi, China).
Littelfuse offered me two months working in China,
before the Mexico facility closure, providing support to
molding operations and failure analysis (FA) on the job
training to the Chinese backend Engineering crew.
Support to Product and Quality Engineering was also
provided by analyzing customer complaints by
fingerpointing the "true" root cause.
Feb 2003 to Jun 2010. Littelfuse / TECCOR de Mexico S. de R.L. de C.V;
H. Matamoros, Mexico
Engineering Section Head. (Mexico Failure analysis Lab
manager)
Responsibilities
. Analyze Customer complaint returned devices, QA
rejects and low yield production batches using
high tech Lab equipment including: X ray, C-SAM
(ultrasonic microscope), Chemical Decapsulation,
hot plate, optical microscopes, curve tracers etc.
to generate useful data, professionally reported,
for direct the engineering efforts for improving
quality rate and reducing scrap. Molding area
continuous support.
. Based on the analysis, identify common potential
failure modes and its root causes. Excel database
creation and update of failure analysis, failure
mode and categorization of root causes.
. Conduct quality focused meetings for identifying
and tracking PPM problems.
. Support on the Renault minidiode qualification and
start up. And on site support to Piedras negras
Littelfuse facility
. MSL-1 test using the Sonoscan based on IPC-J-
STD020 D.
. Solderability test for electronic devices based on
IPC-J-STD002 B.
Main achievements:
With the information provided and the experience gained,
the TdM team was
Able to shoot straight and reduce the PPM's per product
line and overall as a
plant.
With the customer complaints, product engineers are able
to elaborate more
accurate 8D's reports with fulfilled information and
react based on accurate
information.
New TO-220 auto line was able to run steady based on the
Lab analysis
information and recommendations.
Quality Control Supervisor +Molding process engineer.
Responsibilities:
. Lead the 1st shift QC team, follow up of current
procedures.
. Design the new inspection plan but now based on
control charts.
. SPC charts design by identifying key variables or
quality attributes.
Main achievements
Changed the QC inspection from reactive to active.
Molding Process Engineer
Responsibilities:
Manage cost reduction projects such as scrap
reductions and yield improvement (focused on six
sigma thinking)
Create/modify Standard/Operative/quality criteria
procedures & Work instructions.
Update molding parameters based on DOE and SPC
(process optimization)
. Provide continuous support for molding, singulation
and trim & form in all manufacturing lines.
. Minidiode (Renault diode) molding documentation set
up and training for first trials.
. New Molds buy off, installation, workinstruction
creation and operators on the job training.
Main achievements
Important scrap reduction in all molding areas, process
steadiness and less
death time as a result of either the statistical
techniques used for analyzing the
defects output and materials behavior research.
Lead the team that removed a whole non value added
operation (no deflash)
by modifying the trim and form Dies, improving the molds
and choosing better
dejunks steel and metal finishing.
As result of my work with the green epoxy and the solid
partnership with the
EMC providers, the green epoxy was chosen for be used in
China for the
transferred products. (published in Littelfuse insight
magazine).
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Jan 02 - Feb 03 TECCOR de Mexico S. de R.L. de C.V; H. Matamoros,
Mexico
Electronics Technician
Responsibilities:
. Electronic equipment reparation, i.e. Cards,
Testers, Handlers
. Test equipment calibration
. equipment modifications
. Calibration/adjustment of Mechanical devices
. Advanced maintenance initiatives support.
. Mechanical equipment adjust for optimum
quality/production rate
Main achievements:
I manage to adjust some tape and reel machinery for
getting max throughput,
also some increase of OEA by fast repairing of the
production machinery.
Dec 01 - Jan 02 Ampad de Mexico S. de R.L. de C.V; Matamoros,
Mexico
Equipment Maintenance Technician
Responsibilities:
Manufacturing paper equipment reparation and
adjustment.
Oct 00 - Dec 01 TECCOR de Mexico S. de R.L. de C.V; H. Matamoros,
Mexico
Electronics Technician
Responsibilities:
Electronics equipment operation, reparation and
adjustment.
Overseas on-site Experience:
Ivyland PA, USA: Molds Buy off of DO-214 devices, May 2006.
Ivyland PA, USA: Molds Buy off for TO-92 devices., May 2007.
Irving, Texas: Failure analysis with focuses on Customer, March
2008.
Wuxi/Suzhou, China: X ray installation, operation and maintenance
training, December 2009.
Wuxi/Suzhou, China: Failure Analysis training to Chinese engineering
crew; April/May 2010.
Ulm, Germany: Job Interview with Nokia Germany, November 2011.
Boston, USA: Transfer to Mexico of the all polymer capacitor line,
March/2012.
References
Garry Layman Former Cookson Electronics North American Sales
Manager, 001 603-***-****
Jifeng Zhou Wuxi Littelfuse/Concord Semiconductor Lab
Manager. ******@**********.***
Ubaldo Lara Springs Window fashions HR, Victoria
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