Engineer Process

Karen Y. Nishimura

*** **** ****

Washougal, WA *8671

phone: 360-***-****

e-mail: abg5o2@r.postjobfree.com

Education: M. S. Biomedical Engineering

University of California, Davis

B. S. Electrical Engineering and Computer Science

University of California, Berkeley

Objective: Seeking multidisciplinary process engineering (semiconductor

microfabrication/nanofabrication) position.

Experience: September 2004 to present: Senior Process Development Engineer

Sharp Laboratories of America – Camas, WA

Projects:

• Flexible substrates – Researched materials, methods, and equipment for and then

developed a low temperature TFT process flow on flexible plastic (PEN)

substrates.

• Dye sensitized solar cell – Part of team working to develop high-efficiency DSSC.

Specifically, developed and characterized a process for fabricating anatase TiO2

nanotube films and transferring/bonding them to secondary FTO substrate.

• Impedance biosensor - Established wire bonding and packaging scheme, fluidics,

and functionalization of sensor surfaces.

• Si nanoparticle - Worked on sintering process for silicon nanoparticles and

developed TFT top gate process flow utilizing silicon nanoparticle film as active

layer.

• Process development/support - Established clean/deposition/conditioning

processes for AMAT P5000 PECVD TEOS films. Qualified new

photolithography tools (TEL Mark V track and ASML stepper), developed and

wrote track recipes and stepper jobs, and trained researchers in photolithography

processes. Developed and optimized processes for new photomaterials (negative

resists, thick resist AZ9260, SU-8, Cytop, PDMS, WL-5150, liftoff resists, etc.).

Provided fabrication support for various MEMS projects and silicon nanowire

processing.

November 2002 to August 2004: Process Engineer

nLight Photonics – Vancouver, WA

Ran standard photolithography and etch processes. Developed/optimized new processes:

negative photoresist process, new etch chemistries for diode laser products. Worked on

development of microlens lithography and plasma etch processes.

March 2001 to October 2002: Research Engineer

Washington Technology Center Microfabrication Laboratory - Seattle, WA

Characterized processes - e.g., sputter deposition, Bosch deep silicon etch, RIE, wet

chemical etch processes. Taught safety/lab orientation classes; trained lab users on

photolithography and wet/dry etch processing equipment, dicing saw and metrology tools.

Managed chemical inventory and hazardous waste disposal for Microfab Lab. Performed

contract process work for outside customers. Ordered chemicals, supplies, equipment.

Member of Lab’s hazmat/emergency response team.

January 1998 to March 2001: Applications Engineer

Canon U.S.A., Inc. - Eugene, OR

Assisted at customer sites with process issues, and aided in utilizing Canon’s i-line and

DUV steppers. Assisted with alignment and focus issues. Optimized stepper parameters

for customers’ new and existing processes. Conducted lens performance and acceptance

testing of new machines. Analyzed production data to investigate overlay trends and their

relationship to processing or environmental factors.

May 1997 to December 1997: Fab Technician

Integrated Device Technology - Hillsboro, OR

Operated etch (metal, poly, nitiride, oxide) tools and related metrology equipment

(ellipsometer, profilometer, test die prober, microscope) in semiconductor fab. Performed

qualification runs on tools and aided in maintaining equipment.

January 1995 to September 1996: Micromachining Process Technician

L & M Technologies, Inc. - Albuquerque, NM

Contractor to the Microelectronics Development Laboratory at Sandia National

Laboratories.

Oversaw the successful and timely completion of microsensor/actuator lots. Defined

process flows, tracked and facilitated processing, responded to problems, documented

process histories. Performed non-standard micromachining processes and wet-etch

development experiments. Member of MEMS team that developed free-standing

micromachines following wet-etch release from oxide-embedded trenches.

June 1993 to December 1994: Research Technologist

Department of Neurology - University of New Mexico

Maintained operation of computers (Sun workstations, Macintoshes) and associated

peripherals in an MEG laboratory. Applied signal processing and statistical analysis to

data. Performed image processing on data using Khoros and IDL software.

May 1991 to August 1992: Research Assistant

Department of Electrical Engineering - University of California, Davis

Designed and fabricated (silicon micromachining processes) porous silicon membranes for

utilization in a micromachined chemical sensor. Measured and characterized ion transport

across the porous membranes.

Skills: Fab tools: SEM (Hitachi 8820 and Jeol 6650); KLA and OSI metrology tools; ASML

PAS 5500 i-line stepper, TEL Mark V coat/develop track, AMAT PECVD and etch

systems, BMR high density plasma, Canon photolithography steppers (I-line and DUV),

TEL coat/develop track systems; Oxford Instruments System 100 deep reactive ion etcher;

wet processing/etching; MRL, AJA and MRC sputtering systems; Trion, LAM, P5000

plasma etchers.

Strengths: Finding innovative methods to accomplish process goals despite budgetary constraints.

Investigating and researching new materials, chemicals, and equipment; testing said

materials and establishing standard processes to meet project requirements.

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