Engineer Manager

Objective:

I am a Project Engineer/Manager with many years experience in the

design and manufacturing of hi-reliability hardware for the

aerospace and Defense industry. I am passionate about continuing

my career as a Project Engineer/Manager in an industry where I can

contribute and be challenged, and where my skills and experience

can be fully utilized.

professional experience:

1988-2009 Ball Aerospace & Technologies Corp.

Boulder, CO

Electronics Project Manager (2 years): Responsible for cost,

schedule, and technical performance of a cross-functional

engineering team containing design, manufacturing, assembly, and

test to deliver $5.7M spacecraft power system comprised of

numerous electronic assemblies, photovoltaic solar cells, and a

Nickel-Hydrogen common-pressure-vessel (CPV) battery (cell

subcontract management). Developed manpower plans and managed

resource assignments. Created, maintained, analyzed, and reported

Earned Value Management System (EVMS) to external customer along

with regular reporting to internal executive management.

Developed and maintained product structure configuration and

engineering change orders using AGILE Product Data Management

(PDM) tool. Led and facilitated team meetings to provide timely

recognition and resolution of problems. Developed and proposed

costing for out-of-scope work.

Electronics Packaging Department Manager (4 years): Provided

leadership to a group of 45 mechanical engineers, Printed Circuit

Board (PCB) designers, and cable harnessing engineers. Responsible

for employee recruiting, hiring, performance evaluations, salary

adjustments, and developing staffing plans. Standardized and

documented departmental processes and procedures. Developed

automated schematic-to-Printed Wiring Assembly (PWA) bill-of-

material (BOM) software tool. Created company's standardized 6U

VME PWA template compliant with IEEE 1101.1.

Project Engineer/Staff Consultant/ Technical Manager (5 years):

Managed group of 14 electronics packaging engineers. Mentored and

coached new-hire mechanical engineers teaching electronics

packaging skills. Developed and documented company standards for

compliance with ISO 9000. Developed standardized ECAD database

archiving and revision control system. Principal reviewer

supporting customer reviews (IBRs, PDRs, and CDRs) as well as a

tiger team lead member for high visibility, escalated problems

requiring out-of-the-box thinking and innovative solutions.

Electronics Packaging Engineer (10 years): Spacecraft and avionics

electronics packaging design. Hardware design from laboratory

breadboard through conceptual flight and production detail.

Functioned as lead design engineer for numerous electronic design

programs for space applications. Directed and supervised efforts

of drafters and designers covering all phases of design

development. Generated schedules, manpower plans, mass and cost

estimates. Presented at critical design reviews with customer.

Well versed in design documentation procedures per military, NASA

and industrial standards. Design experience with Mentor Graphics

ECAD Circuit Board design system.

1984-1988 TRW Inc. Space Communication Division

Redondo Beach, CA

Electronics Product Engineer (4 years): Spacecraft electronics

packaging including digital, RF, and MMIC hybrid. Developed

packaging design for Wafer Scale Integration. Managed and

coordinated effort of drafters, designers, analysts, and

manufacturing engineers. Responsible for developing proposals,

maintaining budgets and schedules, and presenting reports to

program management and customer.

education:

Bachelor of Science in Mechanical Engineering,

California State University, Long Beach

Strenghts:

. Customer service, satisfaction, and loyalty

. Leadership and team building skills

. Extremely well organized

. Ability to identify and breakdown problems and develop

creative solutions

. Strong verbal and written communication skills

. Extensive knowledge of PCB design and fabrication and

electronic assembly

. Well versed in design and documentation procedures and

specifications per military, NASA and industrial standards

including MIL-STD-100 and ASME Y14.5

. Strong electronics packaging (mechanical) design skills

. Product data structure, Configuration & Data Management

(C&DM), and engineering change orders

. Resolving non-conformance and rework issues with

manufacturing

. Risk assessment and mitigation

. Providing continuous improvement of processes, procedures,

and products

Contact this candidate