Engineer Engineering
Resume:
LOUIS C. GRIFFIN JR.
Rockledge Florida 32955
Strengths & Qualifications:
Project Management:
• Proficient in managing complex short and long-term projects under tight deadlines in continually
changing, fast-paced environments.
• Demonstrated expertise in modifying existing equipment and methods to address changing business
needs.
• Exceptional analytical skills, problem solving abilities, and statistical knowledge.
Laboratory Development:
• Dedicated laboratory technician proficient in the design and execution of complex laboratory
experiments.
• Proven ability to manage time in an efficient and productive manner.
• Proficient at collecting, interpreting and presenting experimental data in a clear and precise manner.
• Goal oriented self starter capable of completing experiments independently and successfully in the time
allotted.
Client Relations / Trainer:
• Excellent communicator with the ability to elicit interest, enthusiasm, and drive using a common sense
approach.
• Skilled in teaching and presenting detailed technical information.
• Proven ability in establishing and maintaining solid customer relations, and providing superior customer
support to internal and external clientele.
Engineering:
• Accomplished field service engineer with more than ten years of experience managing highly complex
repairs and troubleshooting of semiconductor fabrication systems.
• Broad knowledge of precision semiconductor tools and process technology. Self-starter with an involved
style of leadership.
Professional Experience:
Intersil Corporation; Palm Bay, Florida 2003 to Present
Senior Equipment Specialist
Responsible for the installation, repair, preventative maintenance and improvement of numerous
pieces of semiconductor equipment. Present tool status with associated corrective actions at daily
status meetings. Provide training on complex repair and maintenance procedures to other technicians.
Interface with engineering teams on engineering changes and system modifications. Write detailed
reports on root cause of more complicated system failures including suggestions for preventative
measures.
Key Accomplishments:
• Directly responsible for multiple tool relocations, resulting in a savings of $80,000 in Vendor time and
materials.
• Significantly reduced equipment downtime by identifying and correcting preventative
maintenance procedures. Includes unnecessary or missing procedures.
• Provided in-house engineering support on difficult VTR 7000 equipment problems. Resulting
in significant ongoing cost savings previously contracted to vendor (time and materials).
• Promoted from level-2 Technician 2003 to level-4 specialist 2013 (highest level).
International Business Machines; Burlington, VT 2000 to 2003
Senior Equipment Technician
Provided Engineering support, training and analytical troubleshooting to maintenance Technicians
on VTR 7000 Vertical Furnace. Installed and debugged complex engineering changes to
semiconductor processing equipment. Worked in close collaboration with Contamination Control
Department to reduce overall particulate counts in manufacturing clean room. Coordinated and
directed work with Vendor software engineering department to identify and correct software
deficiencies for processing equipment.
Key Accomplishments:
• Directly responsible for tool relocation, resulting in a cost savings in Vendor time and materials.
• Successfully completed joint project with vendor software engineering department to identify and
correct the root cause of an intermittent software error causing product scrap.
• Significantly reduced equipment downtime by identifying and correcting procedural problems
with particle measurement systems.
• Provided in-house engineering support on difficult VTR 7000 equipment problems. Resulting
in significant ongoing cost savings previously contracted to vendor (time and materials).
•
Silicon Valley Group Inc.; Burlington, VT 1997 to 2000
Field Service Engineer II
Provided contracted field service engineering support at IBM microelectronics (Burlington, VT) for
leading manufacturer of semiconductor fabrication tools. Performed advanced troubleshooting and
repair on Silicon Valley Group VTR 7000 vertical furnace.
Key Accomplishments:
• Performed Complex engineering changes On VTR 7000 systems to ensure customer reliability and
process control specifications could be met or exceeded.
• Successfully managed and completed a complex VTR 7000 vertical furnace reconfiguration under
rigid time constraints for Cypress Semiconductor. Recognized by Cypress semiconductor management
for outstanding service provided.
• Trained customer maintenance technicians how to evaluate, analyze and repair VTR 7000 vertical
furnace.
Applied Materials Inc.; Burlington, VT 1992 to 1997
Customer Engineer III - Shift Lead
Provided contracted engineering support and service at IBM Microelectronics (Burlington, VT) for
leading manufacturer of semiconductor fabrication tools. Trained new service engineers in the
installation, maintenance, repair, and upgrading of precision P5000 tools used in Etch and
Chemical Vapor Deposition production. Performed advanced troubleshooting. Primary customer
contact on night production shift.
Key Accomplishments:
• Recognized for excellent training ability. Trained and educated new Applied Material customer
engineers in overview of semiconductor industry, electromechanical and process skills, service
techniques, customer relations, and how to meet customer needs.
• Trained numerous customers (production and maintenance engineers, technicians, and shift leads) in
advanced repair of fabrication systems.
• Generated a best known method for repairing Nupro valve without exposing gas line to atmosphere.
Resulted in safer, less costly, and more efficient procedure minimizing down time.
• Submitted engineer change request resulting in a pending design to improve safety of RF power
connection to fabrication tool chamber.
A.G. Associates; S. Burlington, VT 1990 to 1992
Field Service Engineer
Sole on-site customer service representative at IBM Microelectronics Division (Burlington, VT)
for Sunnyvale, California manufacturer of rapid thermal processors. Installed and debugged first
200mm semiconductor wafer furnaces in collaboration with IBM process engineers. Modified
systems to perform open loop temperature measurements in wafer processing.
Key Accomplishments:
• Recognized by President of A.G. Associates for personal contributions that solidified the Heat Pulse
System as the system of choice for IBM.
• Led on-site installation and debug of new generation of Heat Pulse Systems with IBM customers in
Germany and France.
• In collaboration with marketing staff, coordinated special project with Northern Telecom (Ottawa) to
install rapid thermal processor in development lab, laying the foundation for significant future sales .
• Provided customer engineering field service, tool installation, and maintenance to other eastern U.S.
semiconductor fabricators.
New Look Renovations; S. Burlington, VT 1988 to 1990
Owner / Operator
Marketed and developed carpentry and remodeling business. Collaborated with clients on layout and
design. Supervised staff of two.
IBM Microelectronics; Burlington, VT 1981 to 1988
Senior Laboratory Technician
Designed, developed, executed, and reported data from experiments to optimize next generation
semiconductor memory in process engineering group. Developed new processing techniques. Maintained
and modified laboratory equipment including oxidation furnaces, deposition systems, and chemical
etch/clean station. Programmed microprocessors for tool operation .
Key Accomplishments:
• Assisted in the development of IBM’s first quarter megabit memory chip and world’s first one-million
bit memory chip.
• Author of invention disclosure published in the IBM Journal of Research and Development.
• Delivered presentations on experiment results to engineering groups weekly. Developed computer
generated tables, graphs, and charts to assist in interpreting experimental results.
Education & Training:
Springfield Technical College; Springfield, MA 1981
Associate in Science - Electronic Technology (Cum Laude)
University of Vermont; Burlington VT
Completed courses in Calculus I, II, & III, Statistical Analysis, Physics, Computer Science, and
Electrical Engineering I
Applied Materials Institute; Austin, TX
Successfully completed two month training program in Robotics, CVD, Plasma Etch, and High
Vacuum.
References Available Upon Request
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