Engineer Management

Alison Chen

** ******* ** ******* *****, IL *****-1308

Mobile: 1-206-***-**** (H):847-***-****

***********@*****.***

Permanent Work Authorization: Green Card Holder

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PROFESSIONAL SUMMARY

Work experience with 15 years with PCB layout and IC package design.

Knowledge of assembly and substrate manufacturing processes. Proficient in

drafting with computer aid design software. Trouble shoot package layout

and design problems. Work with cross function teams to support new product

development.

Summary of Qualifications

. Bilingual in Chinese (native Mandarin, Hakka and other dialects) and

English

. Basic Japanese, Korean, and French

. Proficient in MS Office Suite, Adobe, Photoshop, Outlook

. Computer skill with AutoCAD, Pro-E, Cadence APD/Allegro, CAM350,

OrCAD, PADS, Power PCB, etc

. Knowledge of ERP system, Oracle system

PROFESSIONAL EXPERIENCE

Kingpak Technology Inc, Hsinchu, Taiwan 2005 - 2010

IC package assembly service

R&D Senior Product Engineer

. Developed and checked customers' data - responsible for data mining

(collection, refinement, preparation, manipulation of data), analysis,

and presentation of recommendations

. Designed substrate layout as various semiconductor package types.(BGA,

Flip Chip, MCM, Tiny BGA, CMOS image sensor, CSP, Flash memory cards,

DRAM, DDR, FPC).

. Designed manufacturing drafts (Die/wire bonding diagrams, packing

specs, marking specs, Bill of Material list, etc).

. Purchased substrate samples and released to production.

. Worked with substrate vendors to ensure manufacturability and

delivery.

. Managed component libraries.

. Circuit model simulation analysis.

. Worked with relative teams to support production.

Acme Technology Inc, Taoyuan, Taiwan 2003 - 2005

IC package assembly service

R&D Senior Product Engineer

. Worked with customers' data- responsible for data mining (collection,

refinement, preparation, manipulation of data), analysis, and

presentation of recommendations

. Designed substrate layout.(CMOS image sensor, flash memory cards)

. Designed manufacturing drafts (Die/wire bonding diagrams, packing

specs, marking specs, Bill of Material list, etc).

. Purchased substrate samples and released to production.

. Worked with substrate vendors to trail manufacturability and delivery.

. Component library management.

Kingpak Technology Inc, Hsinchu, Taiwan 2000-2002

IC package assembly service

R&D Product Engineer

. Developed and checked client's data- responsible for data mining

(collection, refinement, preparation, manipulation of data), analysis,

and presentation of recommendations.

. Designed substrate layout.(CMOS image sensor, BGA, SDRAM, DRAM, DDR,

flash memory cards)

. Designed manufacturing drafts (Die/wire bonding diagrams, packing

specs, marking specs, Bill of Material list, etc).

. Purchased substrate samples and released to production.

. Circuit model simulation analysis.

Caesar Technology Inc, Hsinchu Taiwan 1995-2000

IC package assembly service

R&D Product Engineer

. Designed substrate layout.(SRAM, DRAM, SOP, SOJ, TPLCC, QFP)

. Designed manufacturing drafts (Die/wire bonding diagrams, packing

specs, marking specs, Bill of Material list, etc).

. Purchased substrate samples and released to production.

. Designed product packing spec.

. Component library management.

Goldstar Technology Inc, Hsinchu Taiwan 1993-1995

Elevator product maintenance

R&D Assistant Engineer

. Designed elevator controller main boards.

. Purchased PCB samples.

. Component library management.

. Document management.

ADDITIONAL WORK EXPERIENCE

Instruction

. Experienced dental hygienist 1995-

2000

. Chinese substitute tutor (Tzu Chi Academy) 2012

. Temperary Accounting Clark 2012

PATEN

Compatible substrate for Image sensor design Taiwan patent

Application Number 094214776

Publication Number M288477

Application Date 2005-08-26

Publication Date 2006-03-01

Inventor: M.N.Ho, Eric Peng, Meiyun Chen, Eric Lin

Assignee Kingpak Technology

IPC H04N 03/14, H01L 23/00

EDUCATION

Ta Hwa Institute of Technology, Hsin Chu, Taiwan

Electronics Engineering graduated

June/1993

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