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Power Plant Mechanical

Location:
Irving, TX
Posted:
September 10, 2013

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Resume:

H ARSH P. PATEL

817-***-****,

*****.*****@****.***.***,

*** * **** **

Apt 115, Arlington TX 76013

MECHAN ICAL ENG INEER

• More than two year experience on educational designing software.

• Worked on CNC programming in FANUC Controller, Six Sigma-ET(Future facilities),Pro-E, Flotherm,

A utoCAD, Icepack, Solidworks, Ansys, FEA analysis, Lab-view, Linux programming, HVAC instruments, CFD

simulation, MS Office, C,

EDUCAT ION

T he University of Texas at Arlington

Master of Science in Mechanical Engineering

A ugust 2011-May 2013

Sardar Patel University, India

Bachelor of Engineering in Mechanical

J uly 2007-June 2011

E xperience

G raduate Research Assistant : University of Texas, Arlington

December 2011-May 2013

P rofessor: Dereje Agonafer (********@***.***)

Working on Facebook Data Centre Project: Mechanical laboratory testing FB servers with Heat-sinks, TIMs,

T hermocouples

PC data acquisition, related experience on fan test with instruments like Air Flow Bench, Environmental

chamber.

Lab assistant: U niversity of Texas, Arlington,

May 2012-August 2012

Research Thesis: Immersion cooling for high end data center server

Project Work

Magnetic Refrigeration

- Alternative and novel method of refrigeration

- How it works,

- Principle,

- Performance,

- Comparison with conventional cycle & advantages of this system,

- Commercial development & future use.

Cooling system in laptop

- Use different design of heat-sink and fan placement in a CPU

1

- C reate an ICEPAK model of CPU,

- Compare all the results and find out effective way to cool system

• Leakage Current analysis on high end servers due to increase rack inlet temperature

- A server is stressed at different CPU utilization and different ambient temperature and the power is measured.

- The server at a specific ambient temperature is considered as the base line and keeping the fan speed

constant by controlling

f unction generator the servers are again stressed at different CPU utilization and ambient temperature and the

power

is measured.

- The differences in power in two cases are calculated to calculate the leakage current and an observation

w ith respect

to change in ambient temperature is made.

• Performance analysis of Base Case Heat sink and validation with Vapor Chamber Heat sink using

copper block

- A copper block with a resistive heater is placed on top of the heat sink and a constant power is supplied

- This set-up is then placed in front of air flow bench and data is logged for temperature using

t hermocouple at four edges of the heat sink and at the bottom of the copper block.

- The air flow is constantly increased and the set-up is changed for the other heat sink. Data are tabulated

and graphs are plotted to compare the results

• Thermal performance and thermal management of server at various ambient temperature-

- Intel based data center server tested at various ambient temperature starting from 15 C to 40 C with

i ncrements of 5 C in Thermotron- Environmental chamber

- Total server power consumption measured at different %CPU loading condition and data are compared

a t different temperatures.

Conferences/Publication/Honors:

2012 NSF I/UCRC for Energy-Smart Electronic Systems (ES2) IAB Meeting, OCT- 2012

2013 NSF I/UCRC for Energy-Smart Electronic Systems (ES2) IAB Meeting, APR-2013

(Poster presentation )

Recipient of “ Electronics MEMS and Nano Electronic Systems Packaging scholarship” for the year 2012-2013

“ I MMERSION COOLING OF H IGH END SERVER “, IMECE, Houston NOV-2013

(Under review)

T raining

Successfully completed training as a part of course curriculum in a Gujarat Industries Power plant Ltd.

(GIPCL), Vadodara

Related Courses:

2

Thermodynamics: Heat and mass transfer, Refrigeration and Air conditioning, Power plant engineering,

T hermal Conduction

Fluid: Fluid dynamics, Fluid power control, Control system and components

Design and manufacturing: Computer Aided Design, Structural Aspects of Design, Computer Aided

manufacturing,

M aterial Science, Metallurgy, Welding and casting technology

Electronics: Fundamentals of Electronics packaging, Computational fluid dynamics in Electronics

packaging

PART IC IPAT ION

Runners up in Glider making event in Sardar Patel University, 2009.

Robot-race competition in Faculty of technology and engineering, Vadodara, 2008.

ME MBERSH IPS

Institute of Engineers (Mechanical)

ASHRAE

SKILLS

• Office skills: Organizational and management, Excellent communication, Quick learner, Team leader.

3



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