Manager Engineer
Resume:
Daniel John David Sullivan
Citizenship: U.S.A.
Email: ***********@*****.***
Summary of Qualifications:
Laboratory Management Failure Analysis Materials Analysis
Surface Science
Solar Power (HCPV) Certification testing (IEC, UL)
Reliability Testing
EDUCATION:
Stanford University SCPD program; Palo Alto, California
EE216, EE214 and EE314
University of California at San Diego; La Jolla,
California
Ph.D. in Chemistry November 21, 1993
Concentrations: Physical Chemistry and Surface Science
University of California at San Diego; La Jolla,
California
M. S. in Chemistry March 2, 1990
University of California at Berkeley; Berkeley, California
B. S. in Chemistry May 5, 1986
EXPERIENCE:
8/2012 - Present Vishay Siliconix: Santa Clara, California
Senior Failure Analysis Engineer: Complete FA analysis of internal and
customer return power MOSFETs, discrete devices and ICs. Analyze packaged
devices and wafers by electrical testing, liquid crystal and emission
microscopy, Acoustic, X-ray, Scanning Electron and optical microscopy. Use
Curve tracer, Dual Beam FIB, plasma and wet chemistry deprocessing to
identify root cause defects. Moving to Lab Manager role.
11/15/2011 - 6/25/2012 NanoLabs: Milpitas, California
Director of Failure Analysis: Direct the growth and organization of a
service lab for failure analysis of ICs and packaged devices. Expand the
lab's capabilities, staff and services offered. Analyze packaged devices
by Acoustic, X-ray and optical microscopy. Develop systems to improve lab
performance and expand toward full FA projects. Expand customer base to
solar, LED, medical devices and other industries. Grow the lab
capabilities by organization, staff training, and expansion.
5/18/2009 - 11/15/2011 ISE Labs: Fremont, California
Manager of FA Lab: Improve and manage a service lab for failure analysis of
ICs and packaged devices. Expand capabilities and service offered as well
as customer base in ICs and to other technologies/industries. Analyze
packaged devices by Acoustic, X-ray and optical microscopy. Investigate
issues on BGAs, PQFPs, flip chip and stacked die systems. Expand customer
base to solar, LEDs, medical devices and other industries. Profitable in
less than 2 years.
10/1/2007 - 3/16/2009 SolFocus, Inc.; Mountain View, California
Manager of Reliability and FA: Managed group of engineers and technicians
in the performance of design development, reliability testing and FA of
components and systems in HCPV products. Qualified key components:
mirrors, receivers, trackers, and modules, through environmental stress
testing and IEC 62108 test programs.
9/2006 - 10/2007 Novalux, Inc.; Sunnyvale, California
Senior Failure Analysis Engineer: Set up and ran FA lab. Supervised FA
technician. Performed FA on solid state Necsel lasers. Operated SEM,
samples preparation, FTIR, and worked with outside vendors for testing.
1/1998-9/2006 LSI Logic; Fremont, California
Analytical Services Laboratory Manager: Managed five technicians and two
engineers. Organization and management of lab resources for deprocessing
and analysis of semiconductor devices. Development of deprocessing and
analysis techniques for new technologies.
6/94 - 12/97 Philips Semiconductors; Sunnyvale, California
Failure Analysis Engineer: Ran the Auger/ESCA lab in the Materials Analysis
Group. Operated Auger, ESCA, SEM, and AFM instruments.
11/93 - 6/94 University of California at Berkeley; Berkeley,
California
Postdoctoral Researcher: Conducting research on heterogeneous reactions in
the upper atmosphere.
8/88 - 11/93 University of California at San Diego; La Jolla,
California
Research Assistant: Studying the interactions of halogens with
semiconductor surfaces.
8/88 - 6/90 University of California at San Diego; La Jolla,
California
Teaching Assistant: Introductions of General Chemistry and Physical
Chemistry lecture courses and a Physical Chemistry lab course.
9/86 - 8/88 Surface Science Labs; Mountain View, California
ESCA Analyst: Operation of an ESCA (XPS) instrument. Obtaining and
interpreting data, problem solving, and customer interaction.
10/85 - 8/86 Lawrence Berkeley Laboratory; Berkeley, California
Research Assistant: Studying the steam gasification of carbon solids.
Operation of flow reactor system with an on-line gas chromatograph.
Publications:
1. S. K. Hsiung, K. V. Tan, A. J. Komrowski, D. J. D. Sullivan, "Failure
Analysis of Short Faults on Advanced Wire-Bond and Flip-Chip Packages
with SQUID Microscopy" ISTFA 2004 Proceedings, pages 73-81.
2. A. J. Komrowski, L. A. Curiel, D. J. D. Sullivan, "Advanced Acoustic
Micro Imaging Applications: Deciphering Multiple Acoustic Echoes and
Reflections" ISTFA 2004 Proceedings, pages 376-379.
3. L. A. Curiel, A. J. Komrowski, D. J. D. Sullivan, " Backside
Application of Acoustic Micro Imaging (AMI) on Plastic Ball Grid
Array (PBGA) and Plastic Flat Pack (PQFP) Packages" ISTFA 2004
Proceedings, pages 389-392.
4. C. Grilletto, S. Hsiung, A. Komrowski, J. Soopikian, D. J. D.
Sullivan, K. Tan, "Infra-Red Reflectance Microscopy (IRRM) for Daisy
Chain Flip Device Failure Analysis" ISTFA 2004 Proceedings, pages 669-
672.
5. D. J. D. Sullivan, L. A. Curiel, K. Tan, "Edge Enhanced Acoustic
Microscopy on Flip-Chip Devices" ISTFA 2005.
6. Daniel Sullivan and Jesse Guzman, "Acoustic Micro Imaging of Large
Objects" Advanced Materials & Processes, August 2012, Vol. 170, No. 8
Pg 22-24.
7. Additional publications: [pic]
Professional memberships/Patents: ACS (American Chemical Society),
EDFAS, MEPTEC, MRS, IEEE, AVS. I hold one patent.
Hobbies: I currently own Earwig Enterprises which makes the board game
Infection and card game GKGD. I also ran SAS, a small analytical
services lab. Ocean Kayaking and Bee keeping.
Key Words: Materials analysis, Failure Analysis, Lab management,
Reliability testing ESCA (XPS), AFM, Auger, SEM, EDS, Cross sections,
Liquid Crystal, EMMI, Dual beam FIB, Curve Tracer, Sample Preparation,
FTIR, XRF, Optical Microscopy, TDR, GCMS, TOFMS, UV/Vis Spectroscopy,
Acoustic Microscopy, Solar certification testing UL and IEC, HALT, HAST,
RBS, Wet chemistry, RIE, FIB, X-ray imaging. Package devices including:
solder bump/ball adhesion, wire bonding, underfill and die attach
issues, reliability testing per Jedec and Mil Spec 883 standards.
REFERENCES: Prof. Andrew C. Kummel; Chemistry Dept. U. C. San Diego
Prof. Gabor A. Somorjai; Chemistry Dept. U. C. Berkeley
Dr. Hugh E. Gotts; Balazs Labs (Air Liquide)
Mr. Emery Sugasawara; Intersil
Mitch Jasen; Coherent, Inc.
Mark Spencer; SolFocus Inc.
Dr. Andrew Komrowski; Maxim
Dr. Sui Lim; Philips
Jesse Guzman
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