RESUME
NAME Park, Song Hee Korean Identification 670***-*****
Number 11
Date of Birth 17 Aug., 1967
Address Blk 62 #10-08 Mei Hwan Dr Goldenhill Park cond.
Singapore.
Contact No. 65-8518-0457(mobile) E-mail *****@*****.***
Permanent 312-109 Hwigyeong-dong Dongdaemun-gu Seoul
address
Career Summary
Extensive experience in Project management positions with over 12 years. 18
years solid Experience semiconductor industry included project direction,
Process development, device engineering, Product development and Yield
improvement. Also, control the schedule, project budget control and
management of staffs.
Key Skill & Capabilities
V Semiconductor Process Design
V Semiconductor Process Development
V Semiconductor Process Qualification
V Low Yield Analysis and Yield Enhancement plan and achievement
V Quality control at process
V 6 sigma Green belt & Black Belt Certificate
V SPC control to Process Data
V Process and Design FMEA
V Semiconductor Device DC Characterization and Device Engineering
V Semiconductor Marketing Team managing
V Semiconductor Marketing Team support
V Semiconductor New Process Line up Planning
V Project management
V Product management
V Control of Manufacture at Foundry Product
V Schedule management
V Risk management and Assessment
V Management of different culture member
V FA Analysis of SEM and FIB
Education Background
Choong Ang High School (Feb. 1986)
Bachelor of Engineering majored in electronics engineering Myongji
University (Feb. 1994)
Career Background
Hynix Semiconductor inc. www.hynix.com
tel 82-31-630-**** fax 82-31-630-****
18/July/1994 ~30/Nov./2004 research laboratory new device part / Principle
research engineer
Dongbuhitek www.dongbuhitek.co.kr
tel 82-2-3484-2888, 82-32-680-**** fax 82-2-3484-2818
30 Nov., 2004 ~ Sep. 2010 Display division /Process development team /
Deputy General Manager
Globalfoundries www.globalfoundries.com
tel +65 6362-2838 fax +65 6362-2938
Oct. 2010 ~ Nov. 2012
Silicon Manufacturing partners Pte. Ltd. process integration team, located
in Singapore/ MTS
Certificate
Certificate:
Ridership for Manager (01 Feb 1998 ~ 14 Feb 1998) Hynix
Project Control (12 Mar 1998 ~ 22 Mar 1998) Hynix
Doing important things first (Flanklin Covey) (01.Aug., 2005 ~ 30.Sep.,
2005) Korea leadership center
Marketing Essence (01 Oct., 2005 ~ 31 Oct., 2005) Dongbu Edulife
Industrial property (Patent) basic course (12 June, 2006 ~ 16 June, 2006)
Korean Intellectual Property Office
eMBA Vivid business administration (01 Mar., 2008 ~ 31 Aug, 2008) HUNET
Ms Project (04 May,2008 ~ 10 May, 2008) Dongbu Edulife
Kairos Course Certificate (Jan. 2013 ~ Mar 2013)
Patent certificate: the United States patent
200********/ SRAM device and method for manufacturing the same
200********/ Static random access memory and method for manufacturing the
same
200********/ NON-VOLATILE MEMORY DEVICE AND METHOD OF FABRICATING A
200********/ Method for fabricating a high voltage dual gate device
200******** / Method for fabricating ferroelectric random access memory
device with
Summary of Main Duties by Project
Sep. 2010 ~ Nov. 2012
- Globalfoundries, Silicon Manufacturing partners Pte. Ltd.
Process integration and Yield Enhancement team, located in Singapore.
- position : Member of technical staff
(accomplishments)
- 0.18um Embedded SONOS Process improvement planning and
management.
- 0.18um ICRF product improvement planning and management.
- 0.18um 1.8V+3.3V+ SONOS ICRF device engineering, Process Qual
and SONOS IP Qual achievement.
- 0.18um 1.8V+3.3V ICRF Product mass production.
- 0.18um 1.8V+3.3V ICRF Product yield improvement.
- 0.14um EEPROM embedded SOC Process and Production.
- 0.14um EEPROM embedded SOC Process Qual and Product Qual
achievement.
Nov. 2004 ~ Sep. 2010
- Dongbu hitek, Display operation division process development
team, located in Bucheon
- position : Deputy General Manager
(accomplishments)
- Marketing team management for sales
- Technical marketing management for sales
- 0.18um, 0.13um, 0.11um DDI Process & Product Planning
- 0.18um, 0.13um, 0.11um DDI Process & Product Team management
- 0.13um 1.5V+5.5V+30V DDI device engineering and Process
Qualification achievement.
- 0.13um DDI Process Option MTP(1Poly EEPROM) Cell achievement
- 0.13um DDI Process Embedded SRAM(2.03um2) Cell achievement
- 0.18um DDI Product mass production management.
- 0.18um Large Panel Process development (13.5V, 20V)
- 0.11um 1.2V+5.5V+30V device engineering and Process
Quaification achievement
- 0.11um DDI Process Option MTP(1Poly EEPROM) Cell achievement
- 0.11um DDI Process Embedded SRAM(1.4877um2) Cell achievement
- 6 sigma Green Belt grant
- 6 sigma Black Belt project complete
- ISO9001, ISO14000, TS16949 follow up.
June 2002 ~ Nov. 2004
- Hynix Memory Business Unit new element Part, located in Icheon
- Position : Principle research engineer (Sinner project Manager)
(accomplishments)
- FeRAM Tech-Line Planning and Process management
- P-RAM Tech-Line Planning and Process management
- 0.25um FeRAM Process development and device engineering.
- 0.18um FeRAM Process development and device engineering.
- 100nm P-RAM element development and device engineering.
April 1997 ~ June 2002
- Hynix System IC Business Unit process development team 3,
located in Cheongju
- Position : Principle Research Engineer ( project manager)
(accomplishment)
- 0.18um ADI Process development, device engineering, Product
development and Yield improvement
- 0.35um DDI Proces development, Product development and Yield
improvement
Include device engineering: 0.35um logic device+13.5V LDMOS+
7.5V Half VDD EDMOS + 10V EPROM Mixed Processing.
- 0.35um OTP Process development and element development
April '95 ~ April '97
- LG semiconductor System IC Business Unit process development team
3, located in Cheongju
- Position : Senior Research Engineer
(accomplishments)
- 0.5um FlatRoom Process development, device engineering, Product
development and Yield improvement.
- 0.5um MCU Process development, device engineering, Product
development and Yield improvement
- 0.5um NOR Flash device engineering, Product development
18 July, '94 ~ April '95
- LG semiconductor process 1 team PI Part, located in Cheongju
- position : Research Engineer
(accomplishments)
- 4M DRAM, 16M DRAM mass production maintenance and management, low
yield analysis and yield improvement work
- 256k SRAM, 1M SRAM mass production maintenance and management,
low yield analysis and yield improvement work
I certify the above statement is true.
Signature
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