Vernon M. Toussaint
**** ********* ** # *** • Charlotte, NC 28262 • 978-***-**** • ***********@*****.***
QUALIFICATION SUMMARY
• M.Sc. in Information Systems & B.Sc. in Electrical Engineering with 16+ years’
professional experience.
• Depth of experience in component level and wafer level processing material
technologies for micro optics, optoelectronics and electronics.
• Strong and extensive background in IC products electrical testing, analysis,
product management and yield improvement.
• Proven ability to successfully and profitably transition prototype products to high
volume manufacturing.
• Experience providing real-time engineering support in a manufacturing
environment.
• Effective in cross-functional team environments leading both small and large
groups.
• Strong work ethic and personal initiative.
• Multiple recent incentive awards for dedication and project execution
TECHNICAL SKILLS
• Application Programming: C/C++, SQL, PL/SQL, Java, BASIC, UML, Pascal.
• Applications: dPower, JMP, MES, Agile, Toad, MS Office, MS Project, Visual
Studio.
• Concepts: Design of Experiments, SPC (Six Sigma, Cpk), Project Management.
• Certification: Applied Material’s Copy Exact certification for Nov 2012 & Mar
2013.
PROFESSIONAL EXPERIENCE
Sept 2012 Senior Product Engineer
- current Digital Optics, - Charlotte, NC
• Managed new product introduction and cross-product issues throughout the
product life cycle.
• Partnered with Test, Development and Process Engineers during start-up and
production release to drive debug activities and reliability qualification.
• Created and maintained documents for product realization, including process
workflows, manufacturing instruction documents, wafer maps, and customer
requirements documents. Performed administrative duties in MES to maintain and
troubleshoot process flows.
• Created, conducted, & analyzed Design of Experiments (DOE) for development
and production activities.
• Provided product-level support to resolve customer issues.
• Actively contribute to engineering efficiency improvements throughout the
organization in areas such as quality systems, training, safety.
Jan 2007 Staff Product Engineer
- Sep 2012 Intersil Corporation, – Richardson, TX
• Project manager providing leadership and management of multiple IC
development projects throughout the life cycle: from design through post production
support.
• Supported cost reduction, yield improvement and customer return activities.
• Derived production test limits using statistical methods and ensuring that products
comply with data sheet electrical and reliability specifications.
• Performed product characterization using tester, bench and thermo stream as well
as reviewing results with core development team.
• Cross-functionally teamed with Designers, Engineering and Manufacturing teams
to achieve critical project milestones, customer samples and timely product release.
• Generated and presented project schedules, development costs and Finished Goods
costs as part of Business Plan review.
• Ordered masks and wafers from external foundries and planning assembly builds
of packaged parts for product qualification and production release.
• Responsibility for pre-silicon planning for customer samples delivery and to
achieve manufacturing readiness.
• Developed, organized and presented program metrics to management during
Quarterly Reviews.
• Conducted project post mortems with management to identify continuous
improvement opportunities by examining successful and unsuccessful project
elements.
• Facilitated recurring team meetings with emphasis on tracking and closing open
actions to achieve project milestones.
Nov 2001 Chute Yield Enhancement Engineer
- Jan 2007 Analog Devices, Inc., – Wilmington, MA
• Drove trim/probe and final test yield enhancement and cost reduction activities of
integrated amplifier products.
• Worked as a member of New Product Release Team to ensure the successful test
development, characterization and release to production of high speed amplifiers.
• Developed plans for process change and led engineering evaluation studies for
fabrication transfer of Bipolar and HVBP processes from Sunnyvale to Wilmington
within the aggressive 6 months schedule.
• Formulated concise trim/probe and final test yield analysis for 4” to 6” wafer
fabrication transfer and polyimide fabrication process change.
• Chaired ADWIL Trim Material Review Board, updated/distributed meeting
minutes and, along with other members, decided disposition of discrepant material.
• Active participant in recruiting new college graduates from my alma mater, UCF,
to the company.
• Mentored new engineers and supervised interns.
Jun 1997 Manufacturing Product Engineer
- Nov 2001 Analog Devices, Inc., – Wilmington, MA
• Worked closely with local and off-shore new product teams to support silicon
debug, product characterization, product validation and manufacturing release of
integrated amplifier product.
• Implemented targeted product engineering projects for improving final test yield.
• Developed yield evaluation plans to compare automatic test equipment results to
bench test performance.
• Optimized final test flows for increased quality and cost improvement;
• Worked closely with external and internal test sites to ensure smooth high volume
production.
• Supervised interns and technician.
EDUCATION
Sept 2003 M.Sc. Information Systems GPA: 3.6/4.
- May 2006 Northeastern University, Boston, MA
Jun 1995 B.Sc. Electrical Engineering GPA: 3.2/4.
- May 1997 University of Central Florida, Orlando, FL
Aug 1989 A.Sc Quality Control and Reliability Control GPA: 4.0/4.
- Aug. 1991 Central Florida Community College, Ocala, FL
AFFILIATIONS
Phi Theta Kappa Honor Society
Institute of Electrical and Electronic Engineers (IEEE).