| Job alert | Jobs 1 - 2 of 2 |
IC Packing Layout Engineer
Amoria Bond
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New Jersey
... Preferred Experience: Script languages: Python, TCL/TK and Perl Electromagnetic simulation tools: Ansys HFSS or Cadence SI/PI - Apr 22
IC Package Design Engineer
Amoria Bond
–
New Jersey
... in semiconductor packaging technologies, including wire bonding, flip-chip, and advanced packaging techniques with package-level simulation tools such as Ansys HFSS and SiWave understanding of signal and power integrity principles, in industry ... - Apr 18