| Job alert | Jobs 1 - 4 of 4 |
Assembly Process Engineering Director
NXP Semiconductors
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Kuala Lumpur, Malaysia
... die bond, or mold Strong leadership skills with good communication Excellent data analysis and data interpretation skills Ability to make sound data-driven decisions Hands on, strong ownership, and able to collaborate as team player Self-motivated; ... - Apr 08
Package Design Electrical Engineer
NXP Semiconductors
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Kuala Lumpur, Malaysia
... - Knowledge on die level Back End of Line (BEOL) design is a plus. - Team player with positive attitude, self-driven proactive mindset, and innovative outlook. - Excellent written and verbal communication and presentation skills are required. - ... - Apr 24
Senior NPI Engineer (Medical Device)
MVC Resources
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Pelabuhan Klang, Selangor, Malaysia
... Design tools/die/jig/fixture for manufacturing process Prepare the Bill of Material for new material. Assist in process cycle time calculation and line balance for new manufacturing line. Establish new test method for raw material and product ... - May 07
HOD NPI Engineering
MVC Resources
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Pelabuhan Klang, Selangor, Malaysia
... Authorized to stop production if equipment and/or process used in production not in state of validated Authorized to approve new process parameter for production operation Authorized to approve new tool/mold/die/jig to be utilized in the production ... - May 03