NXP Semiconductors
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Kuala Lumpur, Malaysia
• Provide support engineering support for Reliability analysis includes but not limited to: 1. Bias Stressing (Burn-in, THB, Hast) 2. ESD Stressing (MM, HBM, CDM) 3. Environmental Stressing (Temp cycle, Autoclave, MSL) 4. Physical Analysis (CSAM... - Jun 13