Vice President - RF/mmWave Systems & Advanced PCB Integration

Location: Richardson, Texas

Job Type: Full-Time, Executive Level

Our client is a U.S.based electronics manufacturing services provider with over 33 years of operation, serving clients in semiconductor, aerospace, medical, and industrial sectors. It is an advanced facility equipped with automated SMT lines, Flying Probe and AOI systems, 3D X-ray inspection, and complete in-house testing and integration capabilities.

They are expanding into RF/mmWave and advanced PCB product development, creating a domestic technology hub for next-generation communications and radar systems.

We are now seeking a visionary leader for the role of Vice President, RF/mmWave Systems & Advanced PCB Integration. This executive position will lead the RF/mmWave product division, driving innovation, product development, and strategic growth across high-frequency technologies. As they transition into a technology-led organization, this role offers not only the opportunity to shape their technical roadmap but also to influence long-term corporate strategy. The position is envisioned as part of their leadership succession plan, with future scope for broader executive and Board-level involvement.

Key Responsibilities:

Lead the design and integration of advanced RF/mmWave subsystems using our PCB manufacturing capabilities.

Develop and execute end-to-end product development cycles, from concept to production.

Build a proprietary RF/mmWave product line for telecom, SATCOM, radar, and aerospace markets.

Oversee validation and compliance programs aligned with aerospace and defense standards.

Mentor cross-functional engineering teams, fostering technical excellence and innovation.

Collaborate with clients to deliver high-performance RF solutions.

Define and drive the RF/mmWave technology roadmap and strategic growth initiatives. Qualifications:

Ph.D. or Master's degree in Electrical Engineering, Applied Physics, or a related field.

10+ years of experience in RF/mmWave systems or advanced PCB design.

Proven leadership in developing and commercializing RF/mmWave technologies.

Strong background in phased arrays, antennas, or metamaterial-based systems.

Excellent communication and cross-functional leadership skills.

Why Join:

This is an opportunity to lead a transformative initiative shaping the future of high-frequency electronics in the U.S. You will define technology direction, influence corporate growth, and be part of the organization's long-term executive leadership evolution.