Proc Dev Engr Sr - SWFL Other Manufacturing

Position Summary: We are looking for a wafer level Electrical Test Engineer for our Florida Advanced Packaging site.

In this role you will lead, develop and improve electrical characterization processes for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP). This includes in-line testing of wafers, final component and package test, RF characterization.

Excellent oral and written communication skills are required to effectively and efficiently communicate ideas with foundry customers, colleagues, and management.

Responsibilities: * Test Development and Execution: Collaborate with the design and product engineering teams to develop test methodologies and test plans for advanced packaging development and production.

Design and implement automated test programs and hardware setups using industry-standard test equipment.

Execute tests on advanced packaging wafers at 300mm according to established test plans.

Troubleshoot and resolve issues that arise during testing, ensuring accurate and reliable measurement data.

* Characterization: Conduct electrical characterization of advanced packaging wafers to analyze their performance.

Perform DC and AC parametric measurements to verify device specifications and optimize performance.

* Data Analysis: Analyze test data and measurement results using statistical analysis software (e.g., JMP, Minitab, Python) to extract meaningful insights and identify trends.

Use this data to evaluate device performance and provide feedback to design teams for continuous improvement.

* Test Automation: Continuously improve test methodologies and automation scripts to enhance efficiency and reduce testing time.

Implement best practices for test automation and data management.

Define and source equipment for final test depending on customer needs.

* Reliability Testing: Assist in reliability testing, including voltage and current stress, and environmental tests, to assess the long-term reliability of packaged devices.

Participate in failure analysis activities when necessary.

* Documentation: Prepare clear and comprehensive test reports, documenting test procedures, results, and observations.

Present findings to cross-functional teams and management as required.

* Collaboration: Work closely with product engineers, process engineers, and design teams to provide valuable input during the development cycle and support product validation efforts.

* Ensure maintenance and calibration of test equipment is up to date in collaboration with equipment team to guarantee accurate and consistent test results.

* Collaborate with yield engineering teams to analyze test data and identify potential yield-limiting factors in the Fan Out Wafer Level Packaging (FOWLP) and Silicon Interposer manufacturing process.

Contribute to yield enhancement efforts through data-driven problem-solving.

* The job also requires performing other duties as assigned.

Percentages of time spent on job duties are estimates and may vary for each position.

Required Qualifications: Education: BS and 1-3 years or MS 0-1 years of engineering experience with on-wafer testing with a focus on CMOS, MEMS, or package yield and characterization.

* Experience in wafer-level CMOS, MEMs or Packaging test and characterization in a wafer fab manufacturing environment.

* Proficiency in using semiconductor test equipment including some or all of these: Automatic Test Equipment (ATE), oscilloscopes, function generators, Keysight test electronics, GPIB communication protocols.

* Experience developing test plans and algorithms for Keysight 4062/4072/4082 is a PLUS.

* Test development programming in C preferred.

In addition, proficiency in one or more of the following programing languages: LabView, C++, C#, Java, Python, Ruby, Visual Basic is a PLUS * Strong data analysis skills using statistical analysis software and scripting languages like Python (Pandas) or MATLAB.

* Solid understanding of CMOS device operation and package characterization techniques.

* Familiarity with test methodologies like DC/AC parametric testing, functional testing.

* Ability to troubleshoot test and measurement issues and collaborate with different teams to find solutions.

* Excellent verbal and written communication skills to convey technical information and collaborate effectively with cross-functional teams.

US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.