Silicon Photonics Flip-Chip Bonding Process Engineer

Apple's Biophotonics team is seeking a Flip-Chip bonding process engineer to join their rapidly expanding silicon photonics group. This individual will work on the research and development of novel integrated photonics devices in sensing applications, being primarily responsible for day-to-day operation, reporting, and documentation of a high-precision flip-chip bonding process. As a key member of a multidisciplinary team working on the next generation of silicon photonics integrated circuits, this position will operate in a dynamic environment that demands a strong understanding of design specifications, deep knowledge of process capabilities and limitations, thorough data analysis, and exceptional communication skills.

BS degree in Optical Engineering, Electrical Engineering, Physics, or similar engineering field.

Background in semiconductor process integration, particularly in the back-end section of the manufacturing process.

3+ years of relevant industry experience.

MS degree in Optical Engineering, Electrical Engineering, Physics, or similar engineering field, with a background in semiconductor processing/fabrication.

Hands-on experience with die bonder tools and processes, or similar high precision assembly tool (flip-chip eutectic AuSn bonding experience beneficial).

Experience working in a cleanroom environment setting.

Strong problem solving ability and experience with material inspection, e.g. optical microscopes, metrology tools, etc.

Electrical and optical test experience.

Knowledge of statistical data analysis, with expertise in using relevant tools (e.g., JMP).

Excellent communication skills, with the ability to work effectively in a team with diverse expertises.