Printed Circuit Board Designer

We have a Fantastic Contract to Hire position for a PCB Design Engineer to join a leading Company located in El Cajon, CA.

The incumbent needs to have experience designing and had the work experience in completing a few boards layout, ideally in the Military and Aerospace markets.

If you are interested in this opportunity, please click the link below to schedule a call:

Pay Rate: $29.00 - $37.00

We are seeking a skilled PCB Design Engineer with expertise in Cadence Allegro PCB Designer (version 24.1) to support the development of high-performance RF and high-speed digital systems. The ideal candidate will take ownership of designs from logic diagrams through layout, fabrication, assembly, and validation, collaborating closely with RF, Electrical, and Mechanical Engineers throughout the process.

Job Responsibilities:

Utilize Cadence Allegro PCB Designer (v24.1) to design and layout complex PCB assemblies.

Lead schematic capture efforts with support from RF and Electrical Engineers.

Drive the entire PCB design lifecycle: logic diagram creation, layout, DFM review, vendor coordination, and test validation.

Apply and manage design rules and constraints, including impedance control, via fencing, and mixed-signal layout techniques.

Work with fabrication and assembly vendors to ensure accurate build and delivery of PCB assemblies.

Assist with bench testing and validation of assembled PCBs.

Apply best practices in RF trace routing (e.g., microstrip, strapline) across various frequency ranges.

Support and potentially lead pre-layout and post-layout simulation and analysis using tools like Cadence VSS, PSpice, and Office.

Contribute to continuous improvement and may investigate adding complementary tools such as OrCAD and Sigrity for future expansion.

Desired Qualifications:

Experience with RF and high-speed digital layout techniques.

Strong knowledge of signal integrity (SI) and power integrity (PI) principles.

Familiarity with RF cascade simulations and advanced PCB construction methods (e.g., 4-layer: RF, GND, DC, GND).

Hands-on experience with schematic capture, PCB layout, and hardware validation.

Proven ability to work cross-functionally with engineering and manufacturing teams.