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RF Engineer

Company:
Smiths Interconnect Inc.
Location:
Town 'n' Country, FL, 33634
Posted:
May 18, 2025
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Description:

Job Description

*Onsite position located in Tampa, FL*

Job Purpose:

Work in an integrated process team environment, with technical responsibility for all of the following, regarding RF/microwave/mmW hardware: research, architecture trades, estimating recurring and non-recurring hardware and activities, analysis, proposals, selection, development, prototyping, verification, customer support, manufacturing support, and sustainment.

Responsibilities:

Have technical responsibility for all aspects of the RF/microwave/mmW hardware within our products, inclusive of UHF through 40GHz

Participate in the entire product lifecycle for bespoke electronics modules, subsystems, and systems for the aerospace and defense market, including for RADAR, EW, SIGINT, comm, and satcom.

Work in an integrated process team (IPT) environment, along with program management, quality, manufacturing, supply chain, and other engineering disciplines

Perform all of the following activities for RF/microwave/mmW hardware: research, architecture trades, estimate recurring and non-recurring hardware and activities, analyze circuits, write technical proposals, select active and passive devices, design single layer substrates and single to multi-layer printed circuit boards, prototyping, verification, customer support, manufacturing support, and sustainment

Technical Knowledge, Skills and Abilities:

Required:

Competent in RF linear and non-linear circuit simulation using Cadence AWR or ADS

Experience with 2.5D and 3D electromagnetic problems and simulation tools

Experience with multi-layer printed wiring boards (PWB) design and layout up to 20 GHz

Experience with single-layer duroid and ceramic layout up to 40GHz

Experience with chip & wire/bare die design, interconnect, and modeling of interconnect

Competent in analog DC, AC, and transient circuit simulation using SPICE or derivative

Competent in RF measurements and design validation procedures

Preferred:

Experience with MMIC development through 40GHz

Knowledgeable of system architecture and block diagram planning of up converters and down converters

Experience with RF system modeling using Cadence AWR VSS

Knowledgeable of frequency planning and mixer spurious analysis for up and down converters

Knowledgeable of phase noise requirements, cascaded phase noise performance, and connection to hardware implementation methods

Knowledgeable with millimeter-wave electronics through 100GHz

General knowledge of the requirements for and design of microwave sources, LNAs, SSPAs, mixers, filters, and synthesizers

SSPA design of at least 10W linear from C-band through Ka Band using GaN or GaAs devices

Experience: 5 to 10 years of progressively increasing experience and responsibility for hardware development through at least 20GHz

Education: Bachelor’s Degree in Electrical Engineering (BSEE)

Travel: Up to 10 % required or as business needs require; predominately within continental U.S.

Security: Must be a US Citizen, with ability to hold US DoD security clearanceCompany Description

Smiths Interconnect is committed to our customers’ success in deploying the most advanced radar, electronic warfare systems, satellite communications, data links, public safety radio networks, and more. Our RF/Microwave component and subsystem heritage is deep, and our commitment to excellence is proven - with over fifty-five years of success in commercial communications, homeland security platforms, and military programs.

Full-time

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