This is an opportunity to join a high-growth start-up that is revolutionising automotive perception technology. With next-generation sensing technology, they are redefining the capabilities of imaging radar, delivering unprecedented resolution and performance.
Role & Responsibilities
In this role, you will lead the validation and characterization of RFICs and packages across the product lifecycle, from prototype through high-volume production at the wafer level and packaged die. You will have strong knowledge and experience in wafer-level probe tests, RF measurements, automated test development and a deep understanding of silicon validation, test hardware design, and manufacturing yield optimization.
ATE Development & Production Ramp
Translate bench tests to automated test equipment (ATE) platforms (i.e., Advantest, Teradyne, NI).
Develop test hardware (load boards, sockets, fixtures) and software for high-volume production.
Reduce test time, improve yield, and ensure test coverage
Prototype Evaluation & Characterization
Elicit test requirements from designers
Collaborate with design and systems teams to define detailed test plans (test list, test equipment and measurement algorithms, etc.)
Develop and execute RFIC validation tests for key performance parameters (i.e., gain, noise figure, linearity, phase noise, S-parameters).
Use lab equipment (VNAs, spectrum analyzers, signal generators, etc.) to verify and debug new designs.
Skills & Experience
Bachelor’s degree in Electrical Engineering or an equivalent
10+ years of relevant experience in semiconductor ATE for RF, Analog, and Mixed Signal circuits
Experience using electrical test instrumentation
Experience developing high-volume automated testing for silicon wafers
Experience in developing high-volume socket testing of silicon packages
Ability and desire to work on rapidly paced projects with several design tasks
Excellent interpersonal, problem-solving, and communication skills
Locations
Bay Area CA or Boston MA