Power Electronics Packaging Engineer

About SF MOTORS, INC. (dba SERES)

At SERES, we’re forging a new kind of mobility company by combining the DNA of advanced automotive engineering and design with that of state of the art smart technologies and connectivity to revolutionize the future of premium electric vehicles. From our corporate headquarters in Silicon Valley, we’re bringing the best and brightest together with a common goal of creating the next generation of smart, clean, connected vehicles for you.

Our vision is to deliver premium electric vehicles that enhance the daily lives of our users, allowing them to live more connected, productive lives through the integration of clean technology, advanced hardware, and software. The future of mobility is more than getting from A to B, it’s about keeping connected to provide users customizable features, when they want it.

Summary

As a Power Electronics Packaging Engineer with SERES, you will be responsible for developing, optimizing, and implementing high-voltage power semiconductor packaging technology for our drive inverters. The ideal candidate has experience designing packaging for high-voltage IGBT/SiC discrete or power modules, applied to automotive mass production.

This is an on-site role based in Milpitas, California.

Duties and Responsibilities

Design and qualify packaging for power IGBT/SiC discrete/modules with external suppliers and internal teams to take the vehicle drive inverter's high-voltage packaged semiconductor components from concept to mass production

FEA simulation analysis including structural, thermal, and electrical characteristics of the packaging design

Solve electronics packaging issues including electrical isolation, thermal management, interconnection, shock and vibration management

Develop validation plans according to industry standards and safety regulations, and evaluate whether new designs are passing

Create drawing packages and manufacturing instructions for parts

Assist in engineering prototype building and component fabrication

Develop and optimize manufacturing processes, including die attach, wire bonding, encapsulation, and testing

Required Education and Experience

BS, MS or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field

7+ years of relevant work experience in semiconductor manufacturing with a focus on power discrete/module packaging

Strong proficiency in FEA analysis and mechanical design tools (e.g., ANSYS, CATIA)

Material science knowledge of materials used in electronics packaging

Strong understanding of electrical design fundamentals, ideally familiar with high-voltage design

Knowledge of design for reliability and design for manufacturability concepts

Exceptional written and verbal communication skills

Strong knowledge of semiconductor fabrication processes, materials, and equipment

Familiarity with industry standards and regulations related to power electronics

Candidates must be legally authorized to work in the United States and verification of employment authorization will be required at the time of hire.

SF MOTORS, INC. (dba SERES) is an equal opportunity employer committed to a culturally diverse workforce. All qualified applicants will receive consideration for employment without regard to race, religion, color, age, sex, national origin, sexual orientation, gender identity, disability status or protected veteran status.