Job Summary
Under limited supervision, solder electronic components both surface mount and through-hole devices to printed circuit boards on a wide variety of sub-assemblies.
Duties and Responsibilities
Remove and replace BGAâ s and leadless devices with hot air rework equipment.
X-ray devices to ensure that the solder is compliant.
Assemble PCBâ s using visual aids and customer documentation.
Remove and replace complex SMT devices.
ECO wiring and etch cuts.
Touch up complex SMT devices.
Remove and replace through-hole devices.
Basic pad and track repair.
Hand-solder through-hole devices and wires.
Touch up solder joints after wave solder. Qualifications
5+ yearsâ experience soldering to IPC standards.
Trained in the following (certifications preferred): IPC-A-610, J-STD-001, IPC7711/7722
Proven ability to read drawings and BOM's and follow the instructions.
Demonstrated abilities with both RoHS (lead free) and standard solder.
Fluent in English, both verbal and written.
Working Environment
Approximately 90% of the work is performed in a precision, light industrial production area. The remaining time will be spent in office and warehouse areas. Physical Requirements
While performing the duties of the job, the associate is regularly required to stand for an extended amount of time, walk and reach with hands and arms.