Job Description
JOB FUNCTION
Responsible for investigating and determining the root causes of failures in electronic components and assemblies during manufacturing and after production. Perform failure analysis such as cross-section, Scanning Acoustic Microscopy (SAM), etc.
RESPONSIBILITIES
Perform reliability tests and data analysis to determine life distribution, failure rate, MTTF, etc.
Perform failure analysis such as cross-sectioning, C-SAM, X-ray to identify root failure causes.
Prepare failure analysis report to address failure root causes.
Execute production defective PCBA boards repair.
NPI build defective boards debugging, analysis and repair.
Work with product engineering team to figure out production issue (Including SMT and PCBA assembly).
Come out failure analysis report, repairing document.
Perform other duties as assigned by supervisor.
QUALIFICATIONS
EDUCATION: Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, or a related field is typically required.
EXPERIENCE: New graduate of Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, or a related field or four years of experience on failure analysis.
SKILLS: Failure analysis knowledge, cross-sectioning skill, C-SAM skill and knowledge, strong communication and documentation skill.
Full-time