Process Integration & Applications Engineer PCB & Advanced

About Thintronics®

More Data. Faster.

Global data volume traffic has been growing exponentially. The onset of AI applications is expected to make this worse. New insulator technology that enables higher frequency data transmission at lower power consumption is required to scale AI infrastructure, starting with the data center fabric. By synthesizing expertise in bottom-up Molecular Design, Computational Mechanics, and Electrical Engineering, Thintronics is unifying and optimizing the high-speed interconnect insulator, from silicon-to-system, enabling the highest data rates at the lowest power.

Thintronics is a start-up company located in Alameda, CA. We are a team of chemists, materials scientists, and engineers shaping the future of data and devices. We offer an exciting start-up environment at the interface of R&D, machine learning-aided product design, manufacturing, and rapid market implementation.

About the Role

We are seeking a Process Integration & Applications Engineer to support the integration of our advanced materials into PCB and semiconductor packaging processes. This position will play a key role in process development, customer support, failure analysis, and laboratory management. The ideal candidate will have a strong technical background in PCB fabrication and/or advanced packaging, hands-on experience with process integration, and the ability to interface directly with manufacturing partners.

Responsibilities

Failure Analysis & Laboratory Oversight

Lead and manage internal laboratory activities, including cross-sectioning, optical and SEM microscopy, and mechanical testing.

Oversee root cause investigations and drive failure analysis activities to closure, supporting both internal teams and customer escalations.

Ensure the laboratory capabilities support internal development, reliability testing, and customer qualification programs.

Define and maintain internal standards for cross-section preparation, defect characterization, and reporting.

Technical Process Integration

Define, execute, and optimize process flows for integration of new materials into PCB and packaging environments.

Support process development and yield improvement in collaboration with PCB shops, packaging, and assembly houses.

Lead qualification activities and work closely with manufacturing partners to drive adoption of new materials and processes.

Apply reliability test methods (CAF, IST, thermal cycling, etc.) and support correlation to field or customer data.

Applications Engineering

Act as a technical interface to customers for material qualification, troubleshooting, and process recommendations.

Translate customer needs into actionable technical requirements and work cross-functionally with R&D, manufacturing, and product teams.

Prepare technical reports, process guidelines, application notes, and customer-facing technical documentation.

General Requirements

Strong problem-solving skills with a hands-on approach to process and application challenges.

Ability to document process flows, qualification plans, failure analysis reports, and technical documents in a clear, structured, and professional manner.

Capable of developing and maintaining internal documentation standards, including process guidelines and work instructions.

Effective communication skills for both internal collaboration and customer engagement.

Comfortable working in cross-functional teams, coordinating across materials, design, process engineering, and manufacturing.

Willingness to travel to customer sites, manufacturing partners, and suppliers as needed.

Qualifications

Bachelor’s or Master’s degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.

3+ years of experience in PCB fabrication, semiconductor packaging, or electronic materials and processes.

Solid understanding of PCB stack-ups, lamination, drilling, plating, imaging, and finishing processes.

Familiarity with advanced packaging (FCBGA, SIP, RDL, embedded die, etc.).

Experience with PCB/packaging process integration, qualification, and yield improvement.

Knowledge of dielectric materials, copper processing, solder mask, and finishes.

Experience with failure analysis, cross-sections, microscopy, and defect characterization.

Level of Engineer (I, II, III, Senior, etc.) will depend on overall qualifications and years of experience.

Compensation/Benefits

Annual salary: $90,000 - $180,000

100% employee coverage for Health/Vision/Dental Insurance

Unlimited PTO policy

Equity/Stock Options