We seek a passionate device level failure analysis engineer for an Austin client. Our client is a highly recognized US semiconductor company that is entrepreneurial yet offers the stability and growth one might expect for a long-term career. There are lots of technically challenging opportunities to sharpen your skills.
You will perform: Device-level FA in a collaborative environment to support customer returns, product qualifications, yield excursions, and new product development ... Electrical and physical fault isolation on mixed-signal IC devices to identify root cause of failure ... Produce technical reports ... Evaluate and introduce new equipment and techniques.
Title: Engineer (senior, lead & principal levels)
Location: Austin, Texas. Hybrid onsite 2-3 days weekly. Full relocation is offered.
Compensation: Depending on experience, a base salary to ~$195,000. Client offers a stellar benefits package. A solid bonus upside along with RSUs.
This will get our attention:
- Hands-on proficiency with electrical fault isolation tools and techniques such as photo-emission, static and dynamic laser stimulation, LVx, scan diagnostic techniques, ATE, thermal imaging, nanoprobing, and applications bench testing
- In-depth understanding of CAD layout, ATE and bench test data logs, digital and analog circuits, device physics, IC fabrication and assembly
· Familiarity with common IC failure mechanisms and quality stress configurations
· Excellent analytical skills and problem-solving ability
· Strong technical writing and verbal communication skills
Highly desirable:
- Failure analysis of non-volatile memory (NVM) devices
- SEM, FIB, EDS, AFM, planar delayering, chemical deprocessing, chemical decoration
Current H1B visa holders or TN eligible professionals are encouraged to apply.