IC Packaging Lead

IC Package Lead – Mountain View

Acceler8 Talent is seeking a Packaging Design Lead to join an exciting and well-funded AI hardware start-up that is developing a new class of network hardware to drastically reduce the cost of running AI workloads.

As an Packaging Lead you will lead the planning, analysis, and integration of advanced packaging solutions for a new category of product that will revolutionize next-gen AI computation.

Requirements

MS or PhD in EE or MechE, plus 10+ years of experience

Hands on large body size, high power, high speed substrate design using Cadence APD/SIP/Xpedition

Strong understanding of SI/PI, Ansys HFSS, and SiWave.

Good knowledge of package and PCB materials and material properties.

Experience with 2.5D packaging and interposer integration

Proven track record driving substrate layout engineering teams.

Direct experience with production qualification and post-production activities.

They are looking for someone to start right away and are offering $250k-$300k base with a generous equity package

Please apply here or contact Luke at to hear more.