Die Attach Assembler

Our client is one of the fastest growing companies to provide electronic semiconductor components to a variety of industries and is one of the largest U.S.

based providers of Semiconductors.

They are expanding their production capacity.

The 1st Shift Hours Are Monday-Friday 7am to 3:30pm Qualifications and Education Requirements * High School Diploma or equivalent and minimum 1 year experience in electronics, or semiconductor assembly * Basic Computer Skills (Data Entry) * Familiarity with ESD/Clean Room Protocol * Detail Oriented * Familiarity with ISO9001 and MIL-PRF-19500 * Ability to manipulate small parts with tweezers and other hand tools * Ability to work with a microscope for extended periods * Able to lift 20 lbs., sit, stand, and walk for extended periods Die bonding is a manufacturing process used in the packaging of semiconductors.

It is the act of attaching a die (or chip) to a substrate or package by epoxy or solder, also known as die placement or die attach.

The process starts with picking a die from a wafer or waffle pack and then placing it at a specific location on the substrate.

The die is placed into a previously dispensed epoxy or placed into solder (eutectic). In the case of eutectic die bonding, the process involves heat and gas management to control the conditions of reflow of the solder.