RF-mmWave Packaging Engineer

Responsibilities:

Design, simulate and validate advanced RF/mmWave packaging/module solutions. Liaise with OSAT vendors for manufacturing.

Design, simulate and validate Integrated passive device (IPD). Liaise with foundry for Tapeout.

Design PCB schematic, layout and perform circuit and 3D EM simulation.

RF lab debug, tuning, performance optimization and validation.

Minimum Qualification:

3+ years of experience in developing RF/mmWave packages and IPD design.

At least BSEE or BSc in related engineering discipline

In depth knowledge in electromagnetics, RF filters, PA and LNA design.

Experience with foundry Tapeout and working with OSAT vendors.

Experience in RF schematics, layouts, and DFM.

Experience with RF lab equipment and probe station for device characterization, debug, and component/system performance validation.

Experience using circuit, EM, and thermal simulation tools such as Ansys HFSS, Keysight ADS/Momentum, Cadence Allegro, Cadence Virtuoso, Ansys Icepak, Flotherm.

Good communicator and team player.

Preferred Qualification:

MS or PhD in EE with emphasis on advanced packaging or RFIC/mmWave design

5+ years of relevant industry experience

Familiar with RF system design.

Familiar with regulatory requirements (FCC, CE, etc.).