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Packaging Engineering Manager

Company:
AK Power Solutions
Location:
Vadodara, Gujarat, India
Posted:
April 24, 2024
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Description:

Virbhu India Pvt Ltd – Vadodara (Gujarat), a wholly owned subsidiary of AK Power Solutions (USA), operating in the field of power electronics, has an immediate opening for a Packaging Engineering Manager.

The Packaging Engineering Manager works with minimal supervision and leads others in a team setting to design and support the construction of power converters. This position will also be responsible for developing and reviewing the electronic PCB design, mechanical packaging, cable harnessing and fastening system for power converters and working with component vendors to approve mechanical /electrical design of components.

Responsibilities

Set up and manage the electronic Packaging engineering development team by building a team of Engineers and Technicians.

Work with internal engineering (New Product Definition, Quality and Reliability) and operations groups as well as suppliers including EMS to define and deliver innovative packaging technology for power converters all market segments including EV charging.

Lead the design of proprietary packaging solutions to support our portfolio of products and ensure best in class electrical, mechanical, thermal, and cost performance.

Manage projects autonomously and lead people to achieve complete scope of work. MUST have experience of the same with examples of building and mentoring a team while delivering projects.

Concisely and effectively communicate strategic and tactical execution status to executive management and cross functional teams.

Product photography experience and must be able to use analysis techniques like thermal, structural, high-speed digital, impedance control, etc.

Experience with ArtiosCad design software, ArtiosCad 3D, and Adobe Illustrator.

Strong sense of typography.

Good knowledge of industrial materials and finishes.

Experience in Structural Design.

Qualifications

B-Tech Degree in Electrical Engineering / Mechanical Engineering

Experience in semiconductor/ power electronics packaging technology development.

Experience in a managerial/leadership role.

Experience with electronic packaging processes

Knowledge of IPC-A-600 and 630 design standards.

Ability to work in a fast-paced, high stress environment with high rates of change.

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