Senior RF Design Engineer

Responsibilities:

Own end-to-end RF module/SIP development for products from concept to mass production.

Responsible for module/SIP technology selection, part selection, vendor evaluation, contract development, and performing cost/technology/performance analysis.

Develop module architecture, schematics, and layouts, and work with vendors for DFM and manufacturing.

Perform simulation (RF circuit simulation, 3D EM simulation, and thermal simulation), factory bring up, lab bench debug, performance tuning and optimization, and validation of RF modules/SIPs.

Design, simulate and validate advanced RF packaging/module/SIP

Collaborate closely with cross-functional teams and vendors to ensure RF performance is met at component, board, and system levels.

Evaluate new advanced packaging technology, including design and validation of prototypes.

Domestic/international travel to achieve program milestones.

Minimum Qualification:

3+ years of experience in developing RF modules/SIPs, preferable in wireless consumer electronics or similar industries.

At least BSEE or BSc in related engineering discipline

Experience with advanced packaging technologies and RF module/SIP design

Experience in RF schematics, layouts, and DFM.

Work experience with RF lab equipment for device characterization, debug, and component/system performance validation.

Experience using circuit, EM, and thermal simulation tools such as Ansys HFSS, Keysight ADS/Momentum, Cadence Allegro, Cadence Virtuoso, Ansys Icepak, Flotherm.

Experience with developing RF test specifications and conducting RF lab testing with bench equipment (e.g. network analyzers, communication testers, spectrum analyzers, and oscilloscopes)

Good communicator and team player.

Preferred Qualification:

MS or PhD in EE with emphasis on advanced packaging or RF design

5+ years of relevant industry experience

Experience in RF design and RF advanced packaging technologies.

Experience with WiFi, BT, GPS, and cellular RF implementation.

Experience in bringing RF modules/SIPs to production

Familiar with regulatory requirements (FCC, CE, etc.).