Senior IC Packaging Engineer

Responsible for defining package design rules, process flow and material set for new products including automotive power module packages

Drive alignment between module design requirements and supplier capabilities, to enable new product development and volume manufacturing of power modules

Develop new assembly technologies, run process DOE’s, to define process windows for new package development

Define and Drive reliability testing and qualification of new module packages in conjunction with the reliability group

Work closely with offshore assembly and substrate partners to develop new processes

Work closely with New Product Definition teams to define packages to meet their requirements

Collaborate with multi-functional teams within Power Integrations for successful development, qualification and production ramp of new module products

Transfer knowledge developed in the NPI process to the sustaining team to ensure a smooth transition to production

Job Requirements

BS Degree in Electrical Engineering, Mechanical Engineering, Material Science

5 years of experience in semiconductor packaging technology

Experience in leaded multi-die packages

Understanding of organic laminate technologies manufacturing and supplier capabilities.

Experience in SMT or passive integrated package assembly is a plus.

Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation (Flip Chip is a plus)

Experience with package substrate design rules, tools (including AutoCAD)

Knowledge of AEQ Automotive reliability requirements

Knowledge of APQP automotive development process

Knowledge of JEDEC/IPC design standards

Ability to set-up Design Rule Checks for verification of every aspect of the PCB layout a plus

Ability to work in a fast-paced, high stress environment with high rates of change