Thin FIlm Manufacturing Engineer

TITLE: THIN FILM MANUFACTURING ENGINEER

FLSA STATUS: EXEMPT

REPORTS TO: SR. MANAGER, THIN FILM MANUFACTURING ENGINEERING

SUMMARY:

Under the direction of the Sr. Thin Film Manufacturing Engineering Manager, the Thin Film Manufacturing Engineer is responsible for the monitoring, sustaining, and supporting day-to-day thin film manufacturing processes utilizing ion beam techniques, including providing technical support to ensure process reliability; verifying process robustness with characterization of process latitudes through experimentation; improving the efficiency of deposition and/or dry etching processes; developing and implementing practices or methodologies which reduce cost and improve operational efficiency; conducting root cause analysis and implementing corrective action; and improving production yields via process/tool manufacturability optimization. This position is located in Milpitas, California.

ESSENTIAL FUNCTIONS:

Monitors, sustains, and supports day-to-day thin film manufacturing processes, programs, and activities

Ensures process reliability by providing technical support to operators, technicians, and other engineers

Collaborates with development team regarding new IBE/RIE/ALD/CVD process integration and manufacturing process improvements

Improves the efficiency of deposition and/or dry etching processes analyzing data, conducting experiments, and researching alternative methods which reduce scrap

Designs and conducts experiments to verify process robustness with characterization of process latitudes

Develops and implements practices or methodologies which lower cost, reduce cycle time, and improve operational efficiency

Conducts root cause analysis and implements corrective action if required

Responds to inquiries from other team members, managers, or departments

Uses Statistical Process Control (SPC) to analyze product quality data; develops charts or reports and presents findings before groups or teams

Adheres to all safety policies and procedures as required

Performs other duties of a similar nature or level*

MINIMUM QUALIFICATIONS:

Bachelor’s degree in Chemistry, Chemical or Electrical Engineering, Materials Science, or Physics and/or equivalent relevant experience; Master’s degree or PhD preferred

Three years of hands on experience working in magnetic thin film fabrication or semiconductor industry in manufacturing or process engineering role

Strong experience using semiconductor device testing, including I-V, C-V, M-H Hysteresis, and Magnetoresistivity

Hands’ on experience in SPC and Design of Experiments (DOE)

Proficient in the use of Microsoft Office Applications

Knowledge, Skills, and Abilities:

Strong knowledge of magnetic thin film fabrication techniques using IBE/RIE/ALD/CVD technology

Strong knowledge of the vacuum tools such as Veeco, Nexus, etc.

Strong knowledge of magnetic thin film fabrication wafer fabrication techniques, processes, and tools

Knowledge of surface analytical/materials characterization techniques, including XRD, AFM, TEM, SEM, and FIB

Knowledge and experience using JMP or Excel and the ability to create macro formulas

Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations

Able to design experiments, analyze results, and recommend corrective action

Able to communicate effectively, both verbally and in writing, with all levels of contractors, employees, and management

Able to work productively and collaboratively with all levels of employees and management

Able to comply with all safety policies and procedures

Able to use critical thinking to resolve issues, conduct root cause analysis, and make recommendations for process improvements

Demonstrated critical thinking and analytical skills

Demonstrated organizational and time management skills

Demonstrated problem-solving and trouble shooting skills

Flexible and able to prioritize

The annual base salary for this full-time position is between $96,655.20-$142,140.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.

WORKING CONDITIONS:

The Thin Film Manufacturing Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Works in a class 100 ESD sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask. May be exposed to hazardous conditions, chemicals, fumes, and/or gases during the course of work day; may be exposed to loud noise. Stands, walks, bends, and twists. Performs various fine grasping movements; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 30 pounds.

*Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.

TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.