Responsibilities β
- Die Attach, Wire Bonding, Sealing, Laser Marking, RF-Testing, Packaging and Tape & Reel
- Loading /Unloading Equipment
- Operate/Run Production Equipment
- Microscope inspection
- Lifting <= 10lbs
- Enter Data in Database system
- Die Attach: Experience in Die Attach / Datacon Equipment preferred
- Bonding: Experience in Wire Bonding / H&K Equipment preferred
- RF Testing: Experience in Testing of ICβs / Automatic and/or Manual Testing
- All other operations: Experience Production Assembly preferred
QUALIFICATIONS β
- 1 year experience in Assembly preferred (not required)
- Experience and ability to work in a fast-paced manufacturing environment.
- Must be able to work well with all levels of personnel whether individually or in a team environment.
- Open to work overtime including possible weekends
- Computer experience/operation necessary.
- The operator will work on a class 10k cleanroom environment
Education β
- Hight School Dimple (Required)