... 2013 to August 2014 Company: TESTECH Position: Inspector Duration: February 2012 to April 2013 Company: IMI (Integrated Microelectronic, Inc.) Position: Quality Assurance/ Quality Control Duration: March 2, 2006 to January 24, 2007 Company: LDI ...
- Sep 23
... 8611 Balboa Ave San Diego, CA 92123 1.5 years 1995-1997 Design Engineer for a high volume manufacturer of multilayer ceramic microelectronic packages. Developed customer requirements into manufacturable designs complete with hard and soft tooling, ...
- Sep 23
... Excel at problem-solving and troubleshooting providing innovative customized computer and telecom networking solutions and customized repair solutions of microelectronic and telecom equipment. Adept at the assembly and setup of satellite, broadband, ...
- Sep 21
... Flip Chip / Direct Attach Technician 10 years Monitored, maintained and corrected computer controlled microelectronic production machines: Transponder Assembly Lines 4000, 5000, and 15,000 Flip Chip Machine 8000, 10,000, and 20,000 Machine setup for ...
- Sep 18
West Hollywood, CA
... PUBLICATIONS AND TALKS • Systemic Optimization of On-chip Thermoelectric Cooling, IEEE CPMT 2015, Kyoto, Japan November 9, 2015 • Patent: Microelectronic Structures Including Cuprous Oxide Semiconductors and Having Improved P-N Heterojunctions. ...
- Sep 16
United Arab Emirates
... Graduation Seminar: Seminar Name : MICRO ELECTRO MECHANICAL SYSTEM DESCRIPTION: Studied, documented & presented this new age concept of fabrication using batch techniques that are similar to those used to fabricate microelectronic devices. It’s the ...
- Sep 16
... Related Coursework: Programming I & II, Microelectronic Devices I & II, Digital Circuit and System, Random Signal, Microcomputer System, Continuous/discrete System, Control Theory Energy Systems, Electric Drives, Power Electronics, Power Systems.
- Sep 14
Nigeria, Port Harcourt, Rivers
... MSc Microelectronic System and Telecommunications (2009- 2010) Institute of Management and Technology, Enugu. HND Electrical Electronics Engineering (1994-1999) Expertise Category Subcategory Ability Experience IT/Communications Telecommunication ...
- Sep 03
... • Manufacturability and cost challenges for future microelectronic packaging : Prof. Amaneh Tasooji Fall’12 Study of challenges in manufacturing and cost efficiency of modern microelectronic packaging and presenting methods to optimize the same. ...
- Aug 31
... The microelectronic sensor can be clamped on a rod at the time of surgery to monitor load in the rod. My responsibility is to ensure the design and product reliability of the sensor and tools for use during the operation. Product design, testing and ...
- Aug 30