Engineer Process

Peter Vo Mesa, AZ • (***) *** – **** • *******@*****.***

Summary of Skills

Project Management, Lean Manufacturing, Six Sigma, Problem Solving, Root Cause Failure Analysis, DOE, FMEA, Leadership, Capital Planning, Product Introduction, Design Review, Value Analysis, Production Management, Panel Design Layout, Reliability Testing

Touchdown Technologies (Parent Co. Advantest Corp) – Baldwin Park, CA Mar 2010 – Aug 2011

Sr. Staff Process Engineer

Led team of material and process engineer along with eleven production operators for the manufacturing of 110, 200, and 300 mm ceramic space transformers MEMS-based full wafer probe cards for testing NOR, NAND, and DRAM DDR3 wafers.

• Successfully developed processes and introduced into mass production the technology’s first fully integrated monolithic, multilayer ceramic space transformers for testing 300 mm DRAM DDR3.

http://www1.verigy.com/ate/news/pr/070110A

Project Planning - Project outlining each milestone with due date and risk for each milestone. Project plan status and highlights were shared with management on a weekly basis.

Introduced products through the use of Gant Chart, Control Matrix, Control Plan, and Sig Sigma (Capability Studies, SPC, and Gage R&R).

Stream lined manufacturing production line by incorporating Lean Manufacturing tools such as Equipment Preventive Maintenance Program, Process Optimization, Standardization of Work Instructions & ECOs, 5S, and SMED.

• Successfully increased production capacity by 10X.

Capacity Planning – Installation Qualification (IQ) of purchased Micro-tec screen printer, Ushio Micro-via Puncher, sintering batch furnace, Avure Iso-static Laminator, work benches and stereo microscopes.

Capital Planning – Created equipment justification report and procurement documentations. Provided equipment layout into facility to maximize efficiency of process groups.

Resource Planning – Added additional labor force of seven operators and added 2nd and 3rd shift production schedules.

• Successfully reduced total product cycle time by 3X.

SMED - Incorporated a single stencil for via fill reducing equipment stencil set-ups from by 20X or from 10 hours to 0.5 hours per job run.

Equipment Qualification (EQ) - Implemented Image Capture Inspection on View Micro-Metrology machine reducing inspection process cycle time by 2X from 349 hours to 166 hours per job run.

• Reduce existing product cost by 75%.

Value Analysis – Replaced conductor material of Vias, Ground planes, and Traces from gold to silver reducing material cost by 85% from $100,000 to $15,000 per job run.

SMED - Incorporated use of a single stencil reducing number of stencils required by 20X saving $10,000 per job run. Incorporated common GND layers reducing the number of screens from 20 to 10 saving $5,000 per job run.

Performance Qualification (PQ) – Silver conductor products achieved by completing qualifications at customer site for reliability and functionality.

• Increase overall product yield by 30%.

Implemented in-line electrical test on Microcraft Flying Prober replacing manual microscope inspection. Automated data allowed for Pareto of Type of Defects assisting in improving yields.

Process Qualification – Implementation of SPC on processes such as Via Punch, Conductor Print, Conductor Via Fill, Lamination, and Sintering

Root Cause Failure Analysis – Performed failure analysis through Problem Solving principles, Ishikawa Diagrams, design reviews, TDR (time domain resistance) measurements, lap and cross-section analysis, and metrology image reviews for electrical opens and shorts root cause failure analysis.

DOE – Performed full factorials to determine critical process variables for Punch, Conductor Via Fill, Conductor Print

GSI Technologies – Burr Ridge, IL 2009 – 2010

Staff Process Engineer

Developed and led engineering processes from thick-film printing, stamping, and packaging enabling the Lab to Fab Production of electrode sensors for medical devices such as glucose test meter, blood coagulation tester, and portable blood cell counter in addition to electronic displays for smart cards, one time pass codes and battery testers.

• Create print plans, work instructions, control plans and related process documents for the daily press production of electrode devices on roll to roll and/ or single feed presses using polymer films and low temperature printable metals. Included programming of Micro-Vu metrology machine for automated visual inspection and feature measurement.

• Daily to weekly communications with customers relaying schedule, process control methods, non-conformances, process control data, experiment results, and project progress.

• Major accomplishments

Launched Portable Blood Cell Counter for customer Millipore.

http://www.millipore.com/life_sciences/flx4/scepter_muse&tab1=2#tab1=2

Discovered and eliminated black dots contamination on silver chloride (Ag/AgCl) metal electrodes – Completed through utilizing Problem Solving principles, series of screening DOEs, external lab analysis, and Performance Qualification (PQ).

TDK R&D Corp (Parent Co. TDK Corp) – Phoenix, AZ 2003 – 2009

Production Manager & Staff Process Engineer

Led team of three engineering technicians to maintain and operated the North American LTCC Prototype Manufacturing Line.

• Established and maintained prototype manufacturing line through capital planning, capital purchases, installation qualifications (IQ), equipment qualifications (EQ) and performance qualifications (PQ).

• Achieved 10X product cycle time reduction through local manufacturing, vendor qualifications, process optimization such as laser drill “punching” instead of “spiraling” for via formation, and eliminating reworks through automated inspection, feature measurements, SPC. Automated Design Rule Check (DRC), Design Panel Layout, Conductor Printing, Stacking, and Visual Inspection and Measurement.

• Matched parent company product quality goals through performance qualifications (PQ) of products (Rx & Tx FEM and UWB Modules). Utilized key process equipment such as TDK Pre-Cutter, ESI Laser Cutter and Marker, AMI Semi-Auto Screen Printer, TDK Auto Screen Printer, TDK Auto Stacker, Avure Iso-Static Laminator, PTC Cutter, SierraTherm Ceramic Furnaces, process tools such as Mesh Screens (Photo-Stencil, Sefar, UTZ, Metal Etch Services), PCBA of EVB boards and assembly incorporating BGA, SMT, die attach, wire bonds, encapsulation, and molding (Avanti Circuits, General Dynamics), and ENIG / ENEG plating (Uyemura Inc). Also utilized key metrology equipment for data collection, SPC and root cause failure analysis such as X-Ray unit, Nikon Nexiv 3D Measurement System, Midas Inspection System, Surfcom Profilometer, and Royce Multi-Strength Tester. Performed DOEs for PET mylar sticking, ENEG plating pad adhesion, conductor print silver thickness, and furnace sintering shrinkage variations.

• Increased company division revenue by 300X by successful product launches of key customer products.

• Maintained and sustained QA and Reliability of emerging products.

Motorola Corp. – Tempe, AZ 1993 – 2003

Product Engineer

Introduced, developed, and outsourced low temperature cofire ceramic RF products and processes.

• Product introduction by creating product data sheet, reliability testing, process evaluation, and foundry qualifications.

• Increased rolled yields and improved processes for new and existing products through evaluation of mechanical and electrical properties for multiple design iterations. Conducted Design Reviews and Manufacturing Readiness Reviews and completed FMEAs and control plans.

• Early development work and fabrication of micro-fluidic fuel cell applications using multilayer ceramic.

• Performed ceramic powder tests to include green/fired density, particle analysis, LOI, sintering, Er, Q, and shrinkage.

Education - University of New Mexico, Albuquerque, NM – BS Mechanical Engineering, 1993

Software - AutoCAD, CAMMaster, EsiCAM, Lotus Notes, MS Office, ASM500, MiniTAB and JMP

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