Engineer Manufacturing
Resume:
PAUL M. DeRONER
Thurmont, Maryland 21788
H: 301-***-**** ************@***.*** M: 301-***-****
CAREER SUMMARY
Highly motivated Manufacturing Engineer/Supervisor with extensive experience in the microelectronics and product development field. Proven track record of quickly and efficiently integrating new information and working with product development groups to transition new products from engineering to volume manufacturing in the United States and China. Extensive knowledge of all aspects of microelectronics equipment, processes, and facility layout and flow. Core competencies lend strength to:
• Quality Control • ISO Procedures
• Configuration Management • Raw and Source Controlled Materials
• Electronics Contract Manufacturing • Microwave Assemblies
• Digital Assemblies • Micro-Electronic Facilities
• Training • Labor Costing
PROFESSIONAL EXPERIENCE
Electronic Instrumentation and Technology, Inc., Sterling, VA. 2010-2012
Manager, Manufacturing
Supervise and Coordinate the activities of multiple shift production workers and schedules.
• Supervise 65 plus workers such as assemblers, inspectors, machine operators and technicians.
• Coordinate with management and other supervisors production schedules, operations, and other activities to meet production schedules.
• Coordinate with management or subordinates to resolve worker problems, complaints, and grievances.
• Demonstrate equipment operations, training, and safety procedures to new employees.
• Enforce safety regulations, company procedures, and policies.
COBHAM SENSOR SYSTEMS (M/A-COM SIGINT Products), Hunt Valley, MD 2004 - 2010
Supply Chain Manager/Sr. manufacturing Engineer
Oversaw the manufacture of SIGINT Signal Processing Equipment and supported new and existing products.
• Managed Supply Chain to ensure materials, parts, and contract manufacturer services were fully compliant with our specifications and quality standards.
• Researched, located, and qualified vendors and contract manufacturers for new and second sources:
o Improved delivery, lower cost, quality materials, and reliability.
o Qualified contract manufactures for the capability to build using BGA’s and QFN’s.
• Developed and resolved solutions to production problems relating to materials, process, and tooling.
• Saved approximately $6K per unit material cost on one product line by going to second source supplier. This increased margins improved quality, reliability and on time delivery.
• Improved quality and reliability of another product line by switching suppliers for key components.
• Authorized the removal of un-reliable and poor performing suppliers from vendor list.
• Other positions held:
o Supervisor Design/Drafting/Documentation 2005 - 2007
o Project Engineer 2004 - 2005
WAVELAB INC., Reston, VA. 2002 - 2004
Manufacturing Engineer Manager
Engineered the manufacturer of 2.5G & 3G wireless data transceivers for Telecom and Internet Service providers for this start-up company.
Paul M. DeRoner Page 2
• Oversaw company-wide manufacturing engineering tasks in the U.S. and China to ensure effective transition of products from development stage to volume manufacture.
• Developed raw material and labor costing for products from BOM creation and assembly time standards of our specific product.
• Developed and implemented new manufacturing techniques suited specifically for our product.
o Development of a lamination process of RF boards to metal carriers in volume.
o Mixed assembly techniques that employ both SMT and Chip and wire process within the same module assembly.
• Set up volume manufacturing facility in China. Which resulted in a 15K square foot assembly and test facility that included approximately 5K square feet of class 10K clean room.
• Interfaced with our partner company in China on issues of equipment selection and purchase, price negotiations with equipment, component manufactures and distributors, facility set up, and manufacturing personnel recruitment.
• Trained and educated China personnel in the manufacturing of our product. Resulting in a dedicated and highly skilled work force can build and test high frequency point-to-point radios.
• Traveled to China frequently to initiate and over see the smooth transition of the product to production.
FILTRONICS – SIGTEK, INC, Columbia, MD. 2001 - 2002
Manufacturing/Rf Engineer
Engineer for product development of millimeter wave point-to-point radios and related products.
THALES COMMUNICATIONS INC., Clarksburg, MD 2000 - 2001
Manufacturing Engineer
Engineered multi product lines relating to Secure Tactical Hand Held Radios and the accessories.
EER SYSTEMS - Wireless Communications Division, Dulles, VA 1999 - 2000
Hardware Engineer/Lab Supervisor
Oversaw product development to manufacture of Local Multipoint Distribution Service (LMDS) Equipment.
AMP, INC., Middletown, PA 1998 - 1999
Manufacturing Engineer, Tycoelectronics Fiber Optics Division
Develop and improve the manufacturability of optical data-com and telecom transceiver devices.
M/A-COM MILLIMETER IC PRODUCTS, Clarksburg, MD 1989 - 1998
Engineering Supervisor
Supervised the Microelectronics Production Assembly, Evaluation Facility, and Space Qualified hardware Assembly Area.
LOCKHEED ELECTRONICS COMPANY, North Plainfield, N.J. 1984 - 1989
Senior Engineering Technicians, Hybrid Electronics Department
Engineered manufacture of Military Standard Hybrid Microelectronic Modules.
GULTON INDUSTRIES INC., Metuchen, N. J. 1981 - 1984
Manufacturing Equipment Technician, Graphic Instruments Division
Manufactured thick film hybrid thermal printing devices
EDUCATION
Associates Degree of Applied Science in Electronics Technology, Somerset County College, New Jersey
Certificate in Electronics, Somerset County Technical Institute, New Jersey.
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