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Mechanical design Engineer

Location:
TN, 642204, India
Posted:
August 22, 2016

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Resume:

KALIMUTHU T

E-mail ID : ******************@*****.***

Mobile No: +918*********.

Address : ****/*, ****** *******,

Pappankulam (po),

Madathukkulam (t.k),

Tirupur-642204.

Career Objective:

I am in the pursuit of acquiring all the competencies for a complete career. Willing to work on challenging missions and critical tasks, which offers potential growth and development through the spirit of teamwork.

Academic Qualification:

Bachelor of Engineering at RVS TECHNICAL CAMPUS-COIMBATORE from Anna university, then with 7.84(CGPA) in 2016.

Higher Secondary School Education from Government Higher Secondary School, Komaralingam with 75.3 % in 2012.

Secondary School Education from Government Higher School, Komaralingam with 79.8% in 2010.

Areas of Interest:

Designing.

Automobile.

Skills &Qualification:

Skilled and working knowledge on AutoCAD, Solidworks.

Working knowledge on CREO (Pro-E)-Part Modelling, Sheet metal, Detailing, etc.

Well versed with the functions of ANSYS Classic/WB inclusive of:

oClassic-Structural&Thermal.

oWB-Structural, Thermal, Coupled, Modal, Explicit and Rigid Dynamics&Buckling.

Knowledgeable in Mechanical Engineering Sciences: Strength of Materials, Automobile.

Projects done:

Design and Analysis of “Bus body Frame using Lightweight Materials”.

Project Role: Team leader.

Conventional designs of bus bodies have more weight and which will affect the carrying capacity, performance and resulting higher fuel consumption. The design of the bus body depends mainly leading the performance constraint under various types of loading and operating circumstances besides those of the road conditions. Majority of the buses are designed and fabricated on the basis ancient time experience. The bus body design parameter essentially consists of shape, stability purpose and strength is carried out at different operating circumstance such as static load and braking loads. The original body is redesigned by changing the thickness and reducing the number of elements so that the total weight of the bus is reduced.

Design and Fabrication of “Thermal Conductivity of Insulating Powder Testing Machine”.

Project Role: Helped in fabrication.

The apparatus consists of two thin walled concentric copper spheres. The inner sphere houses the heating coil. The insulating powder [MgO] is packed between the two shells. The powder supply to the heating coil is by using a dimmer-stat and it is measured by Voltmeter and Ammeter.Choromel-Alumel thermocouples are use to measure the temperatures. Temperature readings in turn enable to find out the Thermal Conductivity of the insulating powder as an isotropic material and the value of Thermal Conductivity can be determined.

Inplant Training and Industrial visit:

Internship training program in “SRT TATA MOTORS” in Peelamedu, Coimbatore from 17.11.2015 to 27.11.2015.

Lakshmi Machine Works Ltd, Kaniyur, Coimbatore.

Sakthi Auto Component Ltd, Perundurai, Erode.

Workshops:

Attended the workshop on “CRYOGENIC ENGINE” by G.Nageswaran, Indian Space Research Organization held at Coimbatore Institute of Technology, Coimbatore on January 2015.

Attended the workshop on “CAD/CAM/CAE SOFTWARE” conducted by TROPUS TECHNOLOGIES at our college campus.

Co-Curricular Activities:

Completed course on “CREO 2.0” at CADD Training Services, Sulur, Coimbatore.

Completed course on “ANSYS” at ARRIS CADD TECHNOLOGIES, Coimbatore.

Extra-Curricular Activities:

Coordinator of ‘Technical events’ in “Eleganze’15” symposium in our college.

Acted as Representative&Leader In during My Bachelor of engineering.

1st price of Tamil essay writing in school level.

Personal Details:

Father’s Name : Thangavel.V

Date of Birth : 30.04.1995.

Gender : Male.

Marital Status : Single

Language known : English, Tamil.

Nationality : Indian

Declaration:

I hereby declare that all the above-mentioned facts are true to the best of my knowledge and belief I will solely be responsible for any discrepancy found in them.

Place:

Date: SIGNATURE



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