Adriana Tuffani

*** ****** ***

Elizabeth, NJ, **201

908-***-****

Email: acuq1p@r.postjobfree.com

Career Objective:

To obtain a challenging position in which I effectively apply my knowledge and educational experience into a dynamic career. To develop and refine my skills within a competitive and adaptable work environment.

Skills Summary:

Knowledge of Production Drawing/ Blue Print Specifications

Knowledge of Cable Harness/Repair, Soldering Repairs, Sub Assembly & Inspection

Able to utilize common sense understanding and strategic planning

Able to communicate in oral and written form to solve problems effectively

Capable of supervising and handling problems in time-constrained situations

Proficient in English, Portuguese and Spanish languages

Professional Experience

CyOptics, Inc./ Avago Technologies, Piscataway, NJ May 2013 – August 2015

Manufacturing Operator for Fiber- Optic Micro-Chips and Devices used in Wireless Broadband Communication. Photolithography: Cleaning, Exposing, Developing and Inspecting Mask Patterns on Silicon Wafers Etch: Cleaning, Etching, Stripping, Inspecting and Measuring of Design Features on Silicon Wafers

Sigma-Netics Inc., Riverdale, NJ December 2010- July 2011

Responsibilities: Preparing Pressure Switches & Sensors for Military/ Aerospace Industrial Markets.

Assembly Housing with Labels, Torque, Crimp, Soldering Rings / Pre-Tinning including Wires, Switches & Resistors.

Quality Control of Parts Inspections for Customers, including Stock Room Placement Orders.

Updating Software Data to provide Floor Plan for Assembly Bellows which include M5, M15,M3 products for Military Aircrafts.

ETI, Electronic Technology Inc., Irvington, NJ May 2006- February 2009

Responsibilities: Preparing Programs that include WH, Pepco Ge, NStars/ Gndct. Cross Phase Trip

PC off -10 Vts.

Experience in Programming Serial Numbers which include Yellow Tags (2-3), High Voltage, Labels, Jumpers and MPR Harness Wiring, which includes inside Header -Pin and Cable Routing.

Bae Systems, Wayne, NJ September 2001- October 2005

Responsibilities: Knowledge of work in Chassis Assembly which include Power Supplies, Blue Prints & Drawings. Programming of Components to circuit printed on Card SMT, Tinning Connectors & Pins

Experience on Government & Military Specializing in Mechanical Sub- Assembly, Hand Soldering, & Wire Processing. Contracts that include Security Regulations & PCB Boards Assembly

SDL/ JDS Uniphase, Piscataway, NJ October 1999- September 2001

Responsibilities: Die Attach in Assembly Technical Micro- Inspection. Knowledgeable in small electronic die and chips, wire bonding; repairing and soldering of micro circuits.

Certification: Precap Visual and Defect Recognition requirements for Soldered with microscope use. Experience in reading floor plans and drawing manual’s and inventory preparation Electrical Assembly which include J- STD-001.

.

Contact this candidate