RUBEN GREGORY P D SAVIO
Email ID: ****************@*****.***
Dallas, TX, USA
Ph: 832-***-****
SUMMARY
University of Arlington graduate with a master of science in Mechanical Engineering.
* ***rs wireless prototype design experience on complex mount steel structures in telecommunication towers, specifications, antenna mount components and also worked on electronic package & server rack in data center.
Sixteen month manufacturing experience working on pressure vessel, Metal Inert Gas Welding and coupling.
4+ year CAD experience in SolidWorks and other software includes with AutoCAD, ANSYS & MS Office Suite. EDUCATION
MS in Mechanical Engineering (Aug 2015) BS in Mechanical Engineering University of Texas at Arlington, TX Sri Krishna College of Engineering, Anna University, India GPA: 3.75/4 GPA: 7.5/10
MAJOR COURSES
Engineering Mathematics Finite Element Analysis (FEA) Thermal Conduction/Convection Engineering Mechanics Structural Dynamics Electronic Packaging Advanced Mechanics of Materials Structural Aspects of Design Control Systems Fluid Mechanics (Hydraulics) Strength of Materials Engineering Drawings WORK EXPERIENCE
Graduate Research assistant
– Team Lead/Member
(University of Texas at
Arlington &
CommScope Inc.)
(Aug 2014-Aug 2015)
Structural Design Analysis of Next Gen Antenna mounts in tele-towers
New Antenna mount with complex parts designed (SolidWorks) & analyzed
(ANSYS) to achieve Low effective projected area (EPA) and high load carrying capacity under constant customer reviews
Work-time reduction for EPA calculation using image processing through MATLAB with only 4% error compared to previous calculation method
ANSI/TIA 222 rev G std & Excel used for calculations & documentation Manufacture Engineer-
Internship
(BHEL, India)
(Aug 2010-May 2011)
Defect analysis on weld beads in MIG welding
40% reduction of defects in weld beads of cooling tubes in pressure vessels achieved by changing the welding torch angle from 90 to 130
Discontinuity of weld beads due to residual magnetism rectified by heating the steel tubes to Curie temperature (727 C) prior to welding PROJECTS
Electronic Packages
(Thermal Analysis)
Spring 2014
Thermal stress analysis on Flip Chip BGA package
Studied thermal stress analysis of the 3D model Flip Chip BGA package
(Creo) for different interconnect solder joint materials using ANSYS Vibration Analysis
(Server Racks)
Fall 2013
Failure analysis on mounted DCoD51RU server racks
Solid CAD modelling of the DCoD51RU server rack done in SolidWorks
Modal analysis, simple harmonic response, Random vibration for given PSD/frequency level on five connected server racks with ANSYS Metal Fabrication
(Spring 2010)
Split type-muff coupling Fabrication
Material calculations, BOM, tolerance, DOE, 2D drawings (AutoCAD), DFM, DFA, surface finishing (grinding) to fabricate the coupling
7% vibration reduction during power transmission by changing coupling material from cast iron to stainless steel.
TECHNOLOGY SKILLS
Design/CAD Auto-CAD (2D/3D), PTC CREO, SolidWorks
CAE tool ANSYS structural, ANSYS Fluent, FloTherm, ICEPAK Software & Language MATLAB, LabView, Microsoft office (Word, Excel, Powerpoint), C/C++ CREDENTIALS
Published a technical paper on “Next Generation Antenna Mount” at InterPACK2015, San Francisco, CA.
Obtained knowledge on ANSYS Model-Based Software and Systems through a seminar conducted by Esterel technologies at UTARI, 2014.
Learned about manufacturing processes of different steel structures in a visit to Gerdau Long Steel North America at Dallas, 2014.
Extensive knowledge on “Plastic Injection Molding and defects” of pump parts through industrial visit to ‘Aqua Pump Industries’ at Coimbatore, India, 2010.