SUMMARY

Currently, working in Western Digital, Bangalore as an Staff Engineer.

Previously, worked in HCL Technologies Ltd as an Lead Engineer in CFD Team (October 2010 to June 2015) and in TATA Power SED as an Senior Mechanical Packaging Design Engineer in CFD Team (July 2015 to 2016) and in CISCO as an Thermal Engineer( July 2016- October 2017) from Maruthi Design Engineering Private Ltd.

Total 8.02 years of Experience in Thermal Management in Electronics cooling domain.

I have experience in Thermal Management in Solid State Drives, Telecommunication, Rugged Electronics, Defense and Auto-domain.

I have hands on experience in Thermal Testing.

CFD Tools :

oHands on experience in ANSYS ICEPAK, Flo THERM, FloTHERM XT

CAD Tools:

oPro-E, Solid Edge, SolidWorks, Design Modeler

KEY SKILLS

ANSYS ICEPAK, Flo THERM

EDUCATION

M.Tech in Thermal Engineering from Jawaharlal Nehru Technological University, Hyderabad, India.

B.Tech in Mechanical Engineering from RVR&JC College of Engineering & Technology, Guntur, India.

WORK EXPERIENCE

Western Digital, Bangalore, India (October 2017 to Present date)

CISCO from Maruti Design and Engineering Private Ltd (July 2016 to October 2017)

TATA Power SED, Bangalore, India. (July 2015 to July 2016)

HCL Technologies Limited, Bangalore, India. (October 2010 to June 2015)

RESPONSIBILITY

For New product development, doing feasibility study by using (leveraging) existed legacy data and model. Sharing results with hardware team and Mechanical design team. And, giving suggestions about placements or design changes if required. Accordingly, next iterations will be continued.

Making Test plan and accordingly, gathering hardware requirement and interacting with software engineers about Traffic availability for Thermal Testing.

Making SOW and interaction with CAD Engineer, PCB Designer and Electrical Engineer regarding inputs like CAD Model, Material details PCB’s layer information, Power dissipation details, Ambient and Active component’s data sheet.

Preparation of quality check list for the project execution.

Modeling of all the parts, defined ambient conditions, assigned material properties and power consumption details, carried analysis and study the results. After that prepared the detailed report on the obtained results. Finally, deliver the project on time after completion of QC.

PROJECTS

PROJECT 1 : Thermal Simulation and Validation of eSSD drives

Software : Ansys ICEPAK 19.1

Description :

Observed Drive behavior at PRD spec and noted temperatures of critical components and validated operating curve.

PROJECT 2 : System air flow Testing of CRS16LC Chassis

Description :

Measured Card impedance, Slot flow testing at all fan speeds and fan failed conditions.

PROJECT 3 : Thermal Testing of RSP4L

Description :

Measured temperatures of all critical components on RSP4L board by using different configurations (with different Line cards in different chassis) at different ambient (25C, 40C, 50C and 55C) as per NEBS standards.

PROJECT 4 : Thermal Analysis of Tactical Accessing Switch

Software : FloTHERM, Solid Edge

Description :

Thermal analysis has done on Tactical Accessing Switch (TAS) at 55 Deg C ambient. This unit consists of three 15U-Racks. Each Rack has 1 Power supply unit, Fan tray and a card cage with 14 cards. 6 Fans are used in every Rack. Among 14 cards, some have child cards also. Total power consumption of TAS is 80W. In this work, heat transfer has done by Forced Convection and Conduction.

PROJECT 5 : Thermal Analysis of Digital Control Harness ++

Software : Ansys ICEPAK, Solid Edge

Description :

Thermal analysis has done on Digital Control Harness (DCH++) at 55 Deg C ambient. This unit consists of stack up of 4 Cards. Total power consumption of DCH++ is 70W. I have got an experience of New Product development in this project. In this work, heat transfer has done by Radiation, Natural Convection and Conduction.

PROJECT 6 : Thermal Analysis of Launcher Interface Unit (LIU)

Software : Ansys ICEPAK, Solid Edge

Description :

Thermal analysis has done on Launcher Interface unit (LIU) at 55 Deg C ambient. This unit consists of card cage with 10 cards and 3 Fans. Total power consumption of LIU is 110W. In this work, heat transfer has primarily done by Forced Convection and Conduction. Performed Burn-in Test and validated simulation results.

PROJECT 7 : Optimization of Heat sink in YP8 Unit.

Software : Ansys ICEPAK, Pro-E

Description :

Initially, Thermal Analysis has done on client given model without implementing any thermal design. Client has interested in decreasing heat sink size which tends to reduce its weight. So, made several iterations by using parametric study option in ICEPAK. Finally, by reducing 40% of the original length of the heat sink, achieved better results.

PROJECT 8 : Thermal Analysis of Solar Inverter Unit

Software : Flo THERM

Description :

Heat transfer analysis of P8011 Solar Inverter Model. Observed the thermal distribution among all the power dissipating components (in AC & DC-Modules, Inverter Assembly). It has worked at the altitude of 2000m and consumed power of 7KW. This model included Steady state and Forced convection.

M.Tech PROJECT: CFD Analysis for Heat Transfer of Molten metal at different time steps in Planar Flow Casting.

Software : ICEM CFD, Fluent

Description :

This work is describing the flow of molten metal from pouring on to rotating drum to solidify the molten metal into metallic strips after losing some amount of heat which is cooled by cooling coils inside the rotating drum. Within a short

span of time all the metallic strips are being generated. This methodology is known as Planar Flow Casting (PFC) process. For this problem we did a transient study to analyze the pouring of molten metal and tried to capture the flow physics very nearer to the reality to evolve this by changing nozzle and drum diameters and air gap increased between nozzle and drum.

PERSONAL INFORMATION:

Date of Birth : 09-06-1985.

Gender : Male.

PAN No : AWZPG4865G

Passport : Yes

Notice Period : 1 Month

Phone No : 096********

Email- ID : ac74p1@r.postjobfree.com

CT

( G.Jagadeeswararao)

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